K3KL7L70EM-MGCU vs K3KL8L80CM-MGCT Perbandingan
Perbandingan bersamaan detil K3KL7L70EM-MGCU dari Samsung Electronics dan K3KL8L80CM-MGCT dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Samsung Electronics
K3KL7L70EM-MGCU - 12Gb LPDDR5X DRAM, 315-Ball FBGA | Samsung
K3KL7L70EM-MGCU ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | K3KL7L70EM-MGCU | K3KL8L80CM-MGCT |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | DRAM |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Samsung Electronics | — |
| Tipe Memori | LPDDR5X SDRAM | LPDDR5X SDRAM |
| Density | 12 Gbit (1.5 GB) | 32 Gbit (4 GB) |
| Paket | 315-ball FBGA | 315-ball FBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Speed Grade Suffix | -MGCU | — |
| Laju Data | [DATA_NEEDED: data rate Mbps/pin] | — |
| Supply Voltage VDD | [DATA_NEEDED: VDD core voltage] | — |
| Supply Voltage VDDQ | [DATA_NEEDED: VDDQ I/O voltage] | — |
| Organisasi | [DATA_NEEDED: organization x32] | x32 |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | -25C to +85C |
| Bank Architecture | [DATA_NEEDED: bank group count] | — |
| Latensi CAS | [DATA_NEEDED: CAS latency] | — |
| Refresh | Self-refresh and per-bank refresh per JEDEC LPDDR5X | — |
| Termination | On-Die Termination (ODT) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (per JLCPCB listing) |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL Level] |
| Max Data Rate | — | 7500 Mbps |
| Clock Frequency | — | 3750 MHz |
| Core Supply Voltage (VDD) | — | 1.05 V |
| I/O Supply Voltage (VDDQ) | — | 900 mV (500 mV low-power mode) |
| VDD2 Supply Voltage | — | 1.8 V |
| Antarmuka | — | LPDDR5X (JEDEC LPDDR5 extension) |
| Application Segment | — | Mobile, Automotive, On-device AI, PC |
| Power Efficiency | — | ~20-25% improvement vs LPDDR5 (per Samsung) |