K4RAH086VB-BIQK vs K4RHE086VB-BCWM Perbandingan
Perbandingan bersamaan detil K4RAH086VB-BIQK dari Samsung Electronics dan K4RHE086VB-BCWM dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4RAH086VB-BIQK | K4RHE086VB-BCWM |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR5 SDRAM | DDR5 SDRAM |
| Density | 16 Gb | 24 Gb |
| Organisasi | 2G x 8 | 2G x 8 |
| Laju Data | 4800 Mbps/pin | 5600 Mbps |
| Core Supply Voltage | 1.1 V (nominal) | — |
| Paket | 82FBGA | 82 FBGA |
| Configuration | X8 | x8 |
| Speed Grade | BIQK (-BIQK bin) | — |
| ECC | On-die ECC (DDR5 standard) | — |
| Antarmuka | DDR5 (CA reduced pin count) | DDR5 (JEDEC) |
| Burst Length | 16 / 32 | — |
| Operating Mode | DLL enabled | — |
| Status RoHS | Compliant (Lead-Free & Halogen-Free per Samsung 82FBGA) | unknown |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Latensi CAS | [DATA_NEEDED: CAS latency (CL)] | — |
| Refresh | [DATA_NEEDED: refresh rate specification] | — |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Tegangan Pemuat | — | 1.1 V |
| Tipe Mounting | — | Surface Mount |
| Application Segment | — | Server / Data Center / Premium PC |
| Manufacturer | — | Samsung Semiconductor |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS latency] |
| On-Die ECC | — | [DATA_NEEDED: on-die ECC support] |
| Package Height | — | [DATA_NEEDED: package height] |