LFE2-6E-6FN256I vs LFE2-6E-5F256C Perbandingan
Perbandingan bersamaan detil LFE2-6E-6FN256I dari Lattice Semiconductor dan LFE2-6E-5F256C dari Lattice Semiconductor. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Lattice Semiconductor
LFE2-6E-6FN256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice
LFE2-6E-6FN256I ✓ AktifLattice Semiconductor
LFE2-6E-5F256C - 6K Lattice ECP2 FPGA, 190 I/O | Lattice
LFE2-6E-5F256C UnknownPerbandingan Spesifikasi
| Parameter Umum | LFE2-6E-6FN256I | LFE2-6E-5F256C |
|---|---|---|
| Merek | Lattice Semiconductor | Lattice Semiconductor |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Unknown |
| Device Type | ECP2 Field Programmable Gate Array (FPGA) | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Cells | 6,000 cells | — |
| Logic Blocks | 750 LABs | — |
| Embedded RAM | 56,320 bits (67 KB) | — |
| User I/O | 190 I/O | 190 pins |
| Maximum Frequency | 357 MHz | — |
| Core Supply Voltage | 1.14 V to 1.26 V | — |
| Nominal Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm |
| Suhu Kerja | -40°C to +100°C | — |
| Temperature Grade | Industrial | — |
| Paket | 256-ball FBGA, 17 mm × 17 mm | 256-pin FBGA, 17 x 17 mm |
| Package Code | FPBGA-256 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Terminal Type | Ball | — |
| Number of Terminals | 256 balls | — |
| Package Shape | Square | — |
| Lead-Free Status | Lead free | — |
| Standard Packaging | Tray | — |
| Standard Quantity | 90 units | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH compliance status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Logic Elements | — | 6,000 cells |
| Logic Array Blocks | — | 750 LABs |
| Total RAM | — | 56,320 bits |
| Tegangan Pemuat | — | 1.14 V to 1.26 V |
| Nominal Supply Class | — | 1.2 V |
| Suhu Hubung Kerja | — | 0°C to 85°C |
| Package Type | — | FBGA |
| Number of Package Pins | — | 256 pins |
| DSP Capability | — | Advanced DSP blocks |
| SERDES Capability | — | [DATA_NEEDED: LFE2-6E-5F256C-specific SERDES capability] |
| Programming Configuration | — | [DATA_NEEDED: configuration memory and programming interface] |