LPC55S26JBD64E vs LPC55S28JBD64E Perbandingan
Perbandingan bersamaan detil LPC55S26JBD64E dari NXP Semiconductors dan LPC55S28JBD64E dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | LPC55S26JBD64E | LPC55S28JBD64E |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | ARM Cortex-M33 (r0p3) | Arm Cortex-M33 |
| Core Size | 32-bit | 32-Bit |
| Frekuensi Bawah Maximum | 150 MHz | 150 MHz |
| Flash Memory | 256 KB | — |
| SRAM | 256 KB | — |
| Connectivity | USB HS, I2C, SPI, UART/USART, I2S, SDIO | — |
| Peripherals | CASPER crypto co-processor, PLU, SCTimer/PWM, DMA, Comparator, Temperature Sensor | — |
| ADC Resolution | 16 bit | — |
| ADC Conversion Rate | 1.0 Msamples/sec | — |
| Security Features | AES, PUF, SHA, CRC, RNG | TrustZone, PUF-based security (S-series) |
| Interrupt Controller | NVIC with NMI input (selectable sources) | NVIC with NMI input (selectable sources) |
| Memory Protection | MPU (Memory Protection Unit) | — |
| Paket | 64-HTQFP (10 x 10 mm) | 64-HTQFP (10x10 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Process Technology | 40 nm NVM | 40 nm NVM |
| Peak Reflow Temperature | 260 C | 260 C |
| Tingkat Sensitivitas Kekeringan (MSL) | 3 | 3 |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Tegangan Pemuat | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| Flash Memory Size | — | 512 KB (512K x 8) |
| SRAM Size | — | 128 KB |
| Series | — | LPC55S2x |
| Memory Protection Unit | — | Yes (MPU) |
| Maximum Time at Peak Reflow | — | 30 s |
| Status RoHS | — | Compliant (e3 lead-free finish) |