LPC55S26JBD64E vs LPC55S28JBD64E 比較
詳細並排比較 LPC55S26JBD64E 由 NXP Semiconductors 與 LPC55S28JBD64E 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | LPC55S26JBD64E | LPC55S28JBD64E |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core Processor | ARM Cortex-M33 (r0p3) | Arm Cortex-M33 |
| Core Size | 32-bit | 32-Bit |
| 最大時脈頻率 | 150 MHz | 150 MHz |
| Flash Memory | 256 KB | — |
| SRAM | 256 KB | — |
| Connectivity | USB HS, I2C, SPI, UART/USART, I2S, SDIO | — |
| Peripherals | CASPER crypto co-processor, PLU, SCTimer/PWM, DMA, Comparator, Temperature Sensor | — |
| ADC Resolution | 16 bit | — |
| ADC Conversion Rate | 1.0 Msamples/sec | — |
| Security Features | AES, PUF, SHA, CRC, RNG | TrustZone, PUF-based security (S-series) |
| Interrupt Controller | NVIC with NMI input (selectable sources) | NVIC with NMI input (selectable sources) |
| Memory Protection | MPU (Memory Protection Unit) | — |
| 封裝 | 64-HTQFP (10 x 10 mm) | 64-HTQFP (10x10 mm) |
| 安裝類型 | Surface Mount | Surface Mount |
| Process Technology | 40 nm NVM | 40 nm NVM |
| Peak Reflow Temperature | 260 C | 260 C |
| 濕度敏感等級 (MSL) | 3 | 3 |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| 供應電壓 | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| Flash Memory Size | — | 512 KB (512K x 8) |
| SRAM Size | — | 128 KB |
| Series | — | LPC55S2x |
| Memory Protection Unit | — | Yes (MPU) |
| Maximum Time at Peak Reflow | — | 30 s |
| RoHS 狀態 | — | Compliant (e3 lead-free finish) |