LPC55S26JBD64E vs LPC55S28JBD64E Karşılaştırma
Ayrıntılı yan yana karşılaştırma LPC55S26JBD64E tarafından NXP Semiconductors ve LPC55S28JBD64E tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | LPC55S26JBD64E | LPC55S28JBD64E |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Core Processor | ARM Cortex-M33 (r0p3) | Arm Cortex-M33 |
| Core Size | 32-bit | 32-Bit |
| Azami Saat Hızı | 150 MHz | 150 MHz |
| Flash Memory | 256 KB | — |
| SRAM | 256 KB | — |
| Connectivity | USB HS, I2C, SPI, UART/USART, I2S, SDIO | — |
| Peripherals | CASPER crypto co-processor, PLU, SCTimer/PWM, DMA, Comparator, Temperature Sensor | — |
| ADC Resolution | 16 bit | — |
| ADC Conversion Rate | 1.0 Msamples/sec | — |
| Security Features | AES, PUF, SHA, CRC, RNG | TrustZone, PUF-based security (S-series) |
| Interrupt Controller | NVIC with NMI input (selectable sources) | NVIC with NMI input (selectable sources) |
| Memory Protection | MPU (Memory Protection Unit) | — |
| Paket | 64-HTQFP (10 x 10 mm) | 64-HTQFP (10x10 mm) |
| Montaj Türü | Surface Mount | Surface Mount |
| Process Technology | 40 nm NVM | 40 nm NVM |
| Peak Reflow Temperature | 260 C | 260 C |
| Nem Hassasiyet Seviyesi (MSL) | 3 | 3 |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| İşletim Sıcaklığı | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Besleme Gerilimi | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| Flash Memory Size | — | 512 KB (512K x 8) |
| SRAM Size | — | 128 KB |
| Series | — | LPC55S2x |
| Memory Protection Unit | — | Yes (MPU) |
| Maximum Time at Peak Reflow | — | 30 s |
| RoHS Durumu | — | Compliant (e3 lead-free finish) |