LPC55S28JBD64K vs LPC55S26JBD64K Perbandingan
Perbandingan bersamaan detil LPC55S28JBD64K dari NXP Semiconductors dan LPC55S26JBD64K dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | LPC55S28JBD64K | LPC55S26JBD64K |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | ARM Cortex-M33 (Armv8-M mainline) | ARM Cortex-M33 |
| Core Size | 32-bit | 32-Bit |
| Frekuensi Bawah Maximum | 150 MHz | 150 MHz |
| Flash Memory | 512 KB | — |
| SRAM | 104 KB | — |
| Tegangan Pemuat | 3.3 V (1.8 V to 3.6 V range) | [DATA_NEEDED: supply voltage range] |
| Security Features | TrustZone, secure boot (S variant) | ARM TrustZone (secure LPC55S2x variant) |
| Peripherals | Flexcomm serial interfaces, USB full-speed device, dual 12-bit ADC, timers/PWM, DMA | [DATA_NEEDED: peripheral list] |
| Connectivity | UART, SPI, I2C, I2S via Flexcomm | — |
| Number of I/O | [DATA_NEEDED: Number of GPIO pins] | [DATA_NEEDED: GPIO count] |
| Suhu Kerja | [DATA_NEEDED: Operating temperature range] | -40C to +105C (TA) |
| Paket | 64-HTQFP (10x10 mm) with exposed pad | 64-HTQFP (10 x 10 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Process Technology | 40-nm NVM | — |
| Product Family | LPC55S2x (LPC5500 Series, EdgeVerse platform) | — |
| Program Memory Type | FLASH | — |
| Data Converters | Dual 12-bit ADC | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Flash Memory Size | — | 256 KB (256K x 8) |
| RAM Size | — | 144 KB (144K x 8) |
| Memory Protection Unit | — | Yes (MPU) |
| Interrupt Controller | — | NVIC with NMI input (selectable sources) |
| Packaging | — | Tray |
| Series | — | LPC55S2x (EdgeVerse platform) |