LPC55S28JBD64K vs LPC55S26JBD64K 比較
詳細並排比較 LPC55S28JBD64K 由 NXP Semiconductors 與 LPC55S26JBD64K 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | LPC55S28JBD64K | LPC55S26JBD64K |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core Processor | ARM Cortex-M33 (Armv8-M mainline) | ARM Cortex-M33 |
| Core Size | 32-bit | 32-Bit |
| 最大時脈頻率 | 150 MHz | 150 MHz |
| Flash Memory | 512 KB | — |
| SRAM | 104 KB | — |
| 供應電壓 | 3.3 V (1.8 V to 3.6 V range) | [DATA_NEEDED: supply voltage range] |
| Security Features | TrustZone, secure boot (S variant) | ARM TrustZone (secure LPC55S2x variant) |
| Peripherals | Flexcomm serial interfaces, USB full-speed device, dual 12-bit ADC, timers/PWM, DMA | [DATA_NEEDED: peripheral list] |
| Connectivity | UART, SPI, I2C, I2S via Flexcomm | — |
| Number of I/O | [DATA_NEEDED: Number of GPIO pins] | [DATA_NEEDED: GPIO count] |
| 工作溫度 | [DATA_NEEDED: Operating temperature range] | -40C to +105C (TA) |
| 封裝 | 64-HTQFP (10x10 mm) with exposed pad | 64-HTQFP (10 x 10 mm) |
| 安裝類型 | Surface Mount | Surface Mount |
| Process Technology | 40-nm NVM | — |
| Product Family | LPC55S2x (LPC5500 Series, EdgeVerse platform) | — |
| Program Memory Type | FLASH | — |
| Data Converters | Dual 12-bit ADC | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Flash Memory Size | — | 256 KB (256K x 8) |
| RAM Size | — | 144 KB (144K x 8) |
| Memory Protection Unit | — | Yes (MPU) |
| Interrupt Controller | — | NVIC with NMI input (selectable sources) |
| Packaging | — | Tray |
| Series | — | LPC55S2x (EdgeVerse platform) |