M1AFS1500-2FGG256 vs A3P600-FG256 Perbandingan
Perbandingan bersamaan detil M1AFS1500-2FGG256 dari Microchip Technology dan A3P600-FG256 dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Microchip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ AktifMicrochip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | M1AFS1500-2FGG256 | A3P600-FG256 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | M1AFS1500 (Fusion) | — |
| System Gates | 1,500,000 | 600000 |
| Logic Cells | 38,400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Frekuensi Bawah Maximum | 350 MHz | — |
| Number of I/O | 119 | — |
| Tegangan Pemuat Kerja | 1.5 V | — |
| Flash Memory Bits (reported) | 276480 | — |
| Technology | CMOS, 130nm class | — |
| Speed Grade | -2 | — |
| Paket / Case | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Gaya Mounting | SMD/SMT | — |
| Rentang Suhu Kerja | 0C to +70C | — |
| Analog Blocks | Configurable analog (Fusion mixed-signal architecture) | — |
| Programming Type | Flash-based (in-system programmable) | — |
| Packaging | Tray | Tray |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Total RAM Blocks | [DATA_NEEDED: RAM block count] | — |
| Family | — | ProASIC3 (Flash FPGAs) |
| Logic Elements | — | 7K LEs (VersaTiles) |
| Embedded SRAM | — | 110592 bits (True Dual-Port) |
| User I/O | — | 177 |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Maximum System Performance | — | Approx. 231 MHz |
| Configuration Technology | — | On-chip flash, reprogrammable, single-chip |
| Power-Up Behavior | — | Instant On Level 0 support |
| Paket | — | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) |
| Tipe Mounting | — | Surface Mount |
| Suhu Kerja | — | 0 C to 85 C (TJ) |
| I/O Banks | — | 4 (independent VCCIBx supplies) |
| Status RoHS | — | RoHS non-compliant (per Microchip USA listing) |
| Manufacturer Lead Time | — | 8 weeks |