M1AFS1500-2FGG256 vs A3P600-FG256 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS1500-2FGG256 sa pamamagitan ng Microchip Technology at A3P600-FG256 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ NakahandaMicrochip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS1500-2FGG256 | A3P600-FG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | M1AFS1500 (Fusion) | — |
| System Gates | 1,500,000 | 600000 |
| Logic Cells | 38,400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Maksimum na Taktiko ng Oras | 350 MHz | — |
| Number of I/O | 119 | — |
| Supply Voltage na Operasyon | 1.5 V | — |
| Flash Memory Bits (reported) | 276480 | — |
| Technology | CMOS, 130nm class | — |
| Speed Grade | -2 | — |
| Packhaging / Kaso | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Hanay ng Temperature na Operasyon | 0C to +70C | — |
| Analog Blocks | Configurable analog (Fusion mixed-signal architecture) | — |
| Programming Type | Flash-based (in-system programmable) | — |
| Packaging | Tray | Tray |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Total RAM Blocks | [DATA_NEEDED: RAM block count] | — |
| Family | — | ProASIC3 (Flash FPGAs) |
| Logic Elements | — | 7K LEs (VersaTiles) |
| Embedded SRAM | — | 110592 bits (True Dual-Port) |
| User I/O | — | 177 |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Maximum System Performance | — | Approx. 231 MHz |
| Configuration Technology | — | On-chip flash, reprogrammable, single-chip |
| Power-Up Behavior | — | Instant On Level 0 support |
| Packhaging | — | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) |
| Uri ng Pagpapasok | — | Surface Mount |
| Temperature na Operasyon | — | 0 C to 85 C (TJ) |
| I/O Banks | — | 4 (independent VCCIBx supplies) |
| Tindminan RoHS | — | RoHS non-compliant (per Microchip USA listing) |
| Manufacturer Lead Time | — | 8 weeks |