M29W128GH70ZA3E vs M29W128GL70ZA3E Perbandingan

Perbandingan bersamaan detil M29W128GH70ZA3E dari Micron Technology dan M29W128GL70ZA3E dari Micron Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Micron Technology
M29W128GH70ZA3E M29W128GH70ZA3E - 128Mbit Parallel NOR Flash, 70ns | Micron

M29W128GH70ZA3E - 128Mbit Parallel NOR Flash, 70ns | Micron

M29W128GH70ZA3E ✓ Aktif
Micron Technology
M29W128GL70ZA3E M29W128GL70ZA3E - 128Mb NOR Flash 70ns 64-TBGA | Micron

M29W128GL70ZA3E - 128Mb NOR Flash 70ns 64-TBGA | Micron

M29W128GL70ZA3E ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum M29W128GH70ZA3E M29W128GL70ZA3E
Merek Micron Technology Micron Technology
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Aktif Aktif
Tipe Memori NOR Flash NOR Flash
Ukuran Memori 128 Mbit —
Organisasi 8M x 16 16M x 8 / 8M x 16
Antarmuka Parallel Parallel
Access Time 70 ns 70 ns
Technology SLC NOR —
Tipe Mounting Surface Mount Surface Mount
Paket 64-TBGA (10x13 mm) 64-TBGA (10x13 mm)
Tegangan Pemuat [DATA_NEEDED: supply voltage range] 3V / 3.3V
Suhu Kerja [DATA_NEEDED: operating temperature range] -40C to +125C
Boot Block Architecture Bottom boot (GH suffix) —
Program/Erase Voltage [DATA_NEEDED: program/erase voltage] —
Endurance [DATA_NEEDED: program/erase cycles] —
CFI Compliant [DATA_NEEDED: CFI compliance] —
Status RoHS [DATA_NEEDED: RoHS status] unknown
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Density — 128 Mbit
Boot Block Location — Bottom boot (GL variant)
Bus Width Selection — BYTE pin (x8/x16)
Packaging — Tray
Product Longevity Program — No
FBGA Code — [DATA_NEEDED: FBGA Code]
Program/Erase Endurance — [DATA_NEEDED: Program/Erase Endurance]

Spek dan Sumber

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