MC33887DWBR2 vs MCZ33287EG Perbandingan

Perbandingan bersamaan detil MC33887DWBR2 dari NXP Semiconductors dan MCZ33287EG dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MCZ33287EG MCZ33287EG - Contact Monitor + Dual Low-Side Driver SOIC-20

MCZ33287EG - Contact Monitor + Dual Low-Side Driver SOIC-20

MCZ33287EG ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum MC33887DWBR2 MCZ33287EG
Merek NXP Semiconductors NXP Semiconductors
Kategori Motor Drivers Interface ICs
Status Lingkungan Hidup Aktif Aktif
Fungsi H-Bridge Motor Driver with Load Current Feedback Contact Monitoring + Dual Low-Side Protected Driver
Konfigurasi Output Half-Bridge / Full-Bridge (H-Bridge) —
Supply Voltage (VDD) 5.0 V to 28 V —
Continuous Load Current 5.0 A —
Peak Load Current 5.0 A (FET protected at higher transients) —
RDS(ON) per MOSFET (typical) [DATA_NEEDED: RDS(ON) at 25C] —
PWM Frequency (max) 20 kHz —
Load Current Feedback Output Yes (analog voltage proportional to IA) —
Control Inputs IN1, IN2 (logic-level inputs) —
Sleep Mode Current [DATA_NEEDED: ISLEEP typ] —
Rentang Suhu Kerja -40C to +125C Automotive grade
Paket / Case 54-SOIC (exposed pad, HSSOP) —
Tipe Mounting Surface Mount Surface Mount
Fault Protection Overcurrent, Overtemperature, Undervoltage Lockout (per datasheet) —
Level MSL [DATA_NEEDED: MSL classification] —
Status RoHS Compliant RoHS Compliant
Origin / Manufacturing Tier Automotive-grade (per distributor product family) —
Contact Sense Inputs — 8 (switch-to-battery or switch-to-ground)
Low-Side Driver Outputs — 2 (internal N-channel MOSFETs)
Supply Voltage Range — [DATA_NEEDED: VCC operating range]
Low-Side Output Current — [DATA_NEEDED: continuous output current per channel]
On-Resistance (Low-Side FET) — [DATA_NEEDED: RDS(on) per channel]
Temperature Grade — Automotive
Paket — 20-SOIC (0.295 inch, 7.50 mm width)
Terminal Form — Gull Wing
Number of Terminals — 20
Package Code — SOP
Package Shape — Rectangular
Lead Free Status — Lead Free
Architecture — Buffer or inverter-based peripheral driver
Internal Protection — Thermal shutdown on low-side drivers

Spek dan Sumber

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