MC9S08DN60ACLH vs S9S08DZ60F2MLHR Perbandingan
Perbandingan bersamaan detil MC9S08DN60ACLH dari NXP Semiconductors dan S9S08DZ60F2MLHR dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S08DN60ACLH | S9S08DZ60F2MLHR |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core | HCS08 (S08 core) | — |
| Lebar Bus Data | 8 bit | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | 60 KB (60K x 8) |
| RAM Size | 2 KB (2K x 8) | — |
| EEPROM | Embedded (size [DATA_NEEDED: EEPROM size]) | [DATA_NEEDED: exact value] |
| Number of I/O | 53 | — |
| Paket / Case | 64-LQFP (10x10 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| ADC | 16-channel, 12-bit, 2.5 us conversion | 12-bit SAR [DATA_NEEDED: channel count] |
| Communication Interfaces | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C | — |
| Oscillator Type | External | — |
| Interrupt Sources | Up to 32 | — |
| Suhu Kerja | -40C to +85C [DATA_NEEDED: confirm automotive grade range] | — |
| Packaging | Tray | — |
| Status RoHS | Compliant | Compliant (per distributor listings) |
| Instruction Set | HC08 + BGND instruction | — |
| On-Chip Debug | BDM (Background Debug Mode) | — |
| Core Architecture | — | HCS08 (S08) 8-bit CISC |
| Maximum CPU Frequency | — | 40 MHz |
| RAM | — | 2 KB [DATA_NEEDED: exact value] |
| Operating Voltage Range | — | 2.7 V to 5.5 V |
| Paket | — | 64-LQFP (10x10 mm) |
| Jumlah Pin | — | 64 |
| Rentang Suhu Kerja | — | -40C to +125C (automotive) |
| CAN Controller | — | 1 x CAN 2.0 A/B (MSCAN) |
| LCD Driver | — | Yes, integrated segment LCD driver |
| AEC-Q100 Qualification | — | Yes (automotive grade) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED] |