MC9S08DN60ACLH vs S9S08DZ60F2MLHR 比較
詳細並排比較 MC9S08DN60ACLH 由 NXP Semiconductors 與 S9S08DZ60F2MLHR 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MC9S08DN60ACLH | S9S08DZ60F2MLHR |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 啟用中 |
| Core | HCS08 (S08 core) | — |
| 資料匯流排寬度 | 8 bit | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | 60 KB (60K x 8) |
| RAM Size | 2 KB (2K x 8) | — |
| EEPROM | Embedded (size [DATA_NEEDED: EEPROM size]) | [DATA_NEEDED: exact value] |
| Number of I/O | 53 | — |
| 封裝 / 外殼 | 64-LQFP (10x10 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| ADC | 16-channel, 12-bit, 2.5 us conversion | 12-bit SAR [DATA_NEEDED: channel count] |
| Communication Interfaces | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C | — |
| Oscillator Type | External | — |
| Interrupt Sources | Up to 32 | — |
| 工作溫度 | -40C to +85C [DATA_NEEDED: confirm automotive grade range] | — |
| Packaging | Tray | — |
| RoHS 狀態 | Compliant | Compliant (per distributor listings) |
| Instruction Set | HC08 + BGND instruction | — |
| On-Chip Debug | BDM (Background Debug Mode) | — |
| Core Architecture | — | HCS08 (S08) 8-bit CISC |
| Maximum CPU Frequency | — | 40 MHz |
| RAM | — | 2 KB [DATA_NEEDED: exact value] |
| Operating Voltage Range | — | 2.7 V to 5.5 V |
| 封裝 | — | 64-LQFP (10x10 mm) |
| 腳位數 | — | 64 |
| 工作溫度範圍 | — | -40C to +125C (automotive) |
| CAN Controller | — | 1 x CAN 2.0 A/B (MSCAN) |
| LCD Driver | — | Yes, integrated segment LCD driver |
| AEC-Q100 Qualification | — | Yes (automotive grade) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED] |