MC9S08QG4CDTE vs MC9S08QG4CFFE Perbandingan
Perbandingan bersamaan detil MC9S08QG4CDTE dari NXP Semiconductors dan MC9S08QG4CFFE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S08QG4CDTE | MC9S08QG4CFFE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Product Type | 8-bit S08 CISC microcontroller | — |
| CPU Clock | 20 MHz | — |
| Program Memory | 4 KB flash | — |
| Program Memory Organization | 4K x 8 bits | — |
| Supply Voltage Range | 1.8 V to 3.6 V | — |
| Architecture | HCS08 enhanced 8-bit core | — |
| Instruction Set | HC08 instruction set with BGND instruction | — |
| I/O Port Count | 6 | — |
| Paket | 16-TSSOP | 16-QFN-EP (5x5 mm), QFN EP |
| Tipe Mounting | Surface mount | Surface Mount |
| Debug Support | Background debugging system with single breakpoint capability | — |
| Product Family | S08QG | — |
| Core Category | 8-bit microcontroller | — |
| Application Category | Low-power embedded control | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Frekuensi Bawah Maximum | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Tegangan Pemuat | — | 2.5 V / 3.3 V |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Status Lingkungan Hidup | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Rentang Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |