MC9S08QG4CDTE vs MC9S08QG4CFFE Perbandingan

Perbandingan bersamaan detil MC9S08QG4CDTE dari NXP Semiconductors dan MC9S08QG4CFFE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC9S08QG4CDTE MC9S08QG4CDTE - 20MHz 8-Bit 4KB MCU | NXP

MC9S08QG4CDTE - 20MHz 8-Bit 4KB MCU | NXP

MC9S08QG4CDTE ✓ Aktif
NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ Akhir Hidup

Perbandingan Spesifikasi

Parameter Umum MC9S08QG4CDTE MC9S08QG4CFFE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif Akhir Hidup
Product Type 8-bit S08 CISC microcontroller —
CPU Clock 20 MHz —
Program Memory 4 KB flash —
Program Memory Organization 4K x 8 bits —
Supply Voltage Range 1.8 V to 3.6 V —
Architecture HCS08 enhanced 8-bit core —
Instruction Set HC08 instruction set with BGND instruction —
I/O Port Count 6 —
Paket 16-TSSOP 16-QFN-EP (5x5 mm), QFN EP
Tipe Mounting Surface mount Surface Mount
Debug Support Background debugging system with single breakpoint capability —
Product Family S08QG —
Core Category 8-bit microcontroller —
Application Category Low-power embedded control —
Suhu Kerja [DATA_NEEDED: operating temperature range] —
RAM Size [DATA_NEEDED: RAM size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Status RoHS [DATA_NEEDED: RoHS compliance status] —
Core Processor — S08
Core Size — 8-Bit
CPU Architecture — HCS08 CISC, HC08 instruction set with added BGND instruction
Frekuensi Bawah Maximum — 20 MHz
Program Memory Size — 4KB (4K x 8) FLASH
Tegangan Pemuat — 2.5 V / 3.3 V
Package Code — HVQCCN
Package Shape — Square
Number of Terminals — 16
Terminal Form — No Lead
Temperature Grade — Industrial
Series — S08QG (QG Series, S08 Family)
Debug Features — Background debugging system, single breakpoint in-circuit plus two more on-chip
Packaging — Tray
Status Lingkungan Hidup — End of Life (per NXP product page)
Program RAM Size — [DATA_NEEDED: Program RAM size]
ADC Resolution — [DATA_NEEDED: ADC resolution and channels]
Number of I/O — [DATA_NEEDED: number of GPIO]
Rentang Suhu Kerja — [DATA_NEEDED: operating temperature range]
Data Converters — [DATA_NEEDED: on-chip data converter summary]

Spek dan Sumber

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