MC9S08QG4CFFE vs MC9S08QD4MSCR Perbandingan

Perbandingan bersamaan detil MC9S08QG4CFFE dari NXP Semiconductors dan MC9S08QD4MSCR dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ Akhir Hidup
NXP Semiconductors
MC9S08QD4MSCR MC9S08QD4MSCR - 8-bit S08 MCU, 4KB Flash, 16MHz | NXP

MC9S08QD4MSCR - 8-bit S08 MCU, 4KB Flash, 16MHz | NXP

MC9S08QD4MSCR ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum MC9S08QG4CFFE MC9S08QD4MSCR
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Akhir Hidup Aktif
Core Processor S08 —
Core Size 8-Bit —
CPU Architecture HCS08 CISC, HC08 instruction set with added BGND instruction —
Frekuensi Bawah Maximum 20 MHz —
Program Memory Size 4KB (4K x 8) FLASH 4 KB (4K x 8) Flash
Tegangan Pemuat 2.5 V / 3.3 V —
Paket 16-QFN-EP (5x5 mm), QFN EP 8-SOIC (SO-8)
Package Code HVQCCN —
Package Shape Square —
Number of Terminals 16 —
Terminal Form No Lead —
Temperature Grade Industrial —
Series S08QG (QG Series, S08 Family) —
Debug Features Background debugging system, single breakpoint in-circuit plus two more on-chip —
Tipe Mounting Surface Mount Surface Mount
Packaging Tray —
Status Lingkungan Hidup End of Life (per NXP product page) —
Program RAM Size [DATA_NEEDED: Program RAM size] —
ADC Resolution [DATA_NEEDED: ADC resolution and channels] —
Number of I/O [DATA_NEEDED: number of GPIO] —
Rentang Suhu Kerja [DATA_NEEDED: operating temperature range] -40 C to +125 C
Data Converters [DATA_NEEDED: on-chip data converter summary] —
Core — HCS08 (S08 core)
Lebar Bus Data — 8 bit
Maximum CPU Frequency — 16 MHz
RAM Size — 256 B
Operating Voltage Range — 2.7 V to 5.5 V
ADC — 10-bit, 4 channels
Timers — Two 16-bit TPM
Communication Interface — SCI (UART)
Debug Interface — Background Debug Mode (BDM), single breakpoint
Instruction Set — HC08 with added BGND instruction
Status RoHS — Compliant
Level MSL — [DATA_NEEDED: MSL Level]

Spek dan Sumber

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