MC9S08QG4CFFE vs MC9S08QD4MSCR Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08QG4CFFE disebabkan oleh NXP Semiconductors dan MC9S08QD4MSCR disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S08QG4CFFE | MC9S08QD4MSCR |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Aktif |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Architecture | HCS08 CISC, HC08 instruction set with added BGND instruction | — |
| Frekuensi Klock Maksimum | 20 MHz | — |
| Program Memory Size | 4KB (4K x 8) FLASH | 4 KB (4K x 8) Flash |
| Tegangan Pemberi Arus | 2.5 V / 3.3 V | — |
| Kemasan | 16-QFN-EP (5x5 mm), QFN EP | 8-SOIC (SO-8) |
| Package Code | HVQCCN | — |
| Package Shape | Square | — |
| Number of Terminals | 16 | — |
| Terminal Form | No Lead | — |
| Temperature Grade | Industrial | — |
| Series | S08QG (QG Series, S08 Family) | — |
| Debug Features | Background debugging system, single breakpoint in-circuit plus two more on-chip | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Status Lingkungan Hidup | End of Life (per NXP product page) | — |
| Program RAM Size | [DATA_NEEDED: Program RAM size] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Number of I/O | [DATA_NEEDED: number of GPIO] | — |
| Gambaran Suhu Operasi | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Data Converters | [DATA_NEEDED: on-chip data converter summary] | — |
| Core | — | HCS08 (S08 core) |
| Lebar Bus Data | — | 8 bit |
| Maximum CPU Frequency | — | 16 MHz |
| RAM Size | — | 256 B |
| Operating Voltage Range | — | 2.7 V to 5.5 V |
| ADC | — | 10-bit, 4 channels |
| Timers | — | Two 16-bit TPM |
| Communication Interface | — | SCI (UART) |
| Debug Interface | — | Background Debug Mode (BDM), single breakpoint |
| Instruction Set | — | HC08 with added BGND instruction |
| Status RoHS | — | Compliant |
| Aras MSL | — | [DATA_NEEDED: MSL Level] |