MC9S12B64MFUE vs MC9S12D64CFUE Perbandingan
Perbandingan bersamaan detil MC9S12B64MFUE dari NXP Semiconductors dan MC9S12D64CFUE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S12B64MFUE | MC9S12D64CFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | HCS12 | — |
| Core | HCS12 (CISC) | HCS12 (16-bit CISC) |
| Lebar Bus Data | 16-bit | — |
| Frekuensi Bawah Maximum | 25 MHz | — |
| Program Memory Size (Flash) | 64 KB (64K x 8) | — |
| RAM Size | 2 KB | — |
| Tegangan Pemuat | 5 V | 2.5 V / 5 V |
| Paket | 80-QFP (14 x 14 mm) | 80-QFP (14 x 14 mm) |
| Jumlah Pin | 80 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Communication Interfaces | CAN, SCI (UART), SPI | — |
| A/D Channels | [DATA_NEEDED: A/D channel count] | — |
| A/D Resolution | [DATA_NEEDED: A/D resolution] | — |
| Timers | [DATA_NEEDED: timer module count] | ECT, TIM, PWM, PIT |
| PWM Channels | [DATA_NEEDED: PWM channel count] | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Status RoHS | RoHS non-compliant (Pb-free process, SnPb or matte tin finish per datasheet packaging code) | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free / Lead Content | [DATA_NEEDED: lead-free status] | — |
| Maximum CPU Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| RAM | — | 4 KB |
| EEPROM | — | 1 KB |
| Number of I/O | — | 59 |
| ADC | — | 8-channel, 10-bit |
| Communication Peripherals | — | 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B) |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |