MC9S12B64MFUE vs MC9S12D64CFUE 比較
詳細並排比較 MC9S12B64MFUE 由 NXP Semiconductors 與 MC9S12D64CFUE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MC9S12B64MFUE | MC9S12D64CFUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Series | HCS12 | — |
| Core | HCS12 (CISC) | HCS12 (16-bit CISC) |
| 資料匯流排寬度 | 16-bit | — |
| 最大時脈頻率 | 25 MHz | — |
| Program Memory Size (Flash) | 64 KB (64K x 8) | — |
| RAM Size | 2 KB | — |
| 供應電壓 | 5 V | 2.5 V / 5 V |
| 封裝 | 80-QFP (14 x 14 mm) | 80-QFP (14 x 14 mm) |
| 腳位數 | 80 | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Communication Interfaces | CAN, SCI (UART), SPI | — |
| A/D Channels | [DATA_NEEDED: A/D channel count] | — |
| A/D Resolution | [DATA_NEEDED: A/D resolution] | — |
| Timers | [DATA_NEEDED: timer module count] | ECT, TIM, PWM, PIT |
| PWM Channels | [DATA_NEEDED: PWM channel count] | — |
| 工作溫度範圍 | [DATA_NEEDED: operating temperature range] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| RoHS 狀態 | RoHS non-compliant (Pb-free process, SnPb or matte tin finish per datasheet packaging code) | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free / Lead Content | [DATA_NEEDED: lead-free status] | — |
| Maximum CPU Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| RAM | — | 4 KB |
| EEPROM | — | 1 KB |
| Number of I/O | — | 59 |
| ADC | — | 8-channel, 10-bit |
| Communication Peripherals | — | 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B) |
| 工作溫度 | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |