MC9S12DG128CPVE vs MC9S12UF32PB Perbandingan
Perbandingan bersamaan detil MC9S12DG128CPVE dari NXP Semiconductors dan MC9S12UF32PB dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S12DG128CPVE | MC9S12UF32PB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Product Type | 16-bit HCS12 microcontroller | — |
| Core Frequency | 25 MHz | — |
| Program Memory | 128 KB flash | — |
| RAM | 8 KB | — |
| EEPROM | 2 KB | — |
| Architecture | HCS12, CISC | — |
| Tegangan Pemuat | 2.35 V to 5.25 V | [DATA_NEEDED: supply voltage range] |
| ADC | Two 8-channel, 10-bit ADCs; 16 channels total | — |
| Serial Communications | Two asynchronous serial communications interfaces | — |
| Timer | 8-channel IC/OC enhanced capture timer | — |
| PWM | 8-channel pulse-width modulator | — |
| Digital I/O | 20 discrete digital I/O lines | — |
| Suhu Kerja | -40°C to +85°C | [DATA_NEEDED: operating temperature range] |
| Paket | 112-LQFP, 20 mm x 20 mm | — |
| Oscillator | Internal oscillator | — |
| Automotive Qualification | AEC-Q100 listed in verified distributor result | — |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH | [DATA_NEEDED: REACH status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | HCS12 |
| Core Processor | — | HCS12 (S12 CPU, 16-bit) |
| Program Memory Size | — | 32 KB (32K x 8) FLASH |
| RAM Size | — | 3.5 KB (3.5K x 8) |
| Frekuensi Bawah Maximum | — | 30 MHz |
| Number of I/O | — | 41 |
| Paket / Case | — | 64-LQFP (10x10 mm) |
| Oscillator Type | — | Internal |
| Program Memory Type | — | FLASH |
| Connectivity | — | SCI, SPI (per HCS12 family) |
| Peripherals | — | PWM, Timers, ADC (per family) |
| Data Converters | — | A/D converter (per family) |
| Tipe Mounting | — | Surface Mount |
| Packaging | — | Tray |
| Status RoHS | — | Compliant |
| Debug Interface | — | BDM (Background Debug Mode) |