MC9S12DG128MPVE vs MC9S12DB128MPVE Perbandingan

Perbandingan bersamaan detil MC9S12DG128MPVE dari NXP Semiconductors dan MC9S12DB128MPVE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC9S12DG128MPVE MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE Nrnd
NXP Semiconductors
MC9S12DB128MPVE MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DB128MPVE ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum MC9S12DG128MPVE MC9S12DB128MPVE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Aktif
Product Family S12DG (HCS12) —
Core Architecture HCS12 (CPU12, 16-bit CISC) HCS12 (CPU12), 16-bit
CPU Clock Frequency 25 MHz (max) —
Bus Clock 50 MHz (max) —
Program Memory (Flash) 128 KB —
RAM 8 KB —
EEPROM 2 KB —
Tegangan Pemuat 2.35 V to 2.75 V (core) / 5 V I/O —
Rentang Suhu Kerja -40C to +125C (automotive grade) —
Digital I/O Pins 59 —
ADC 2 x 10-bit, 8 channels each (16 total) —
PWM Channels 8 channels —
Enhanced Capture Timer 8-channel IC/OC —
SCI (UART) Channels 2 —
SPI Channels 1 —
CAN Module 1 (msCAN) —
Paket 112-LQFP (20 x 20 mm, 0.5 mm pitch) —
Tipe Mounting Surface Mount Surface Mount (Gull Wing)
Status RoHS Compliant Compliant
Status Lingkungan Hidup NRND (Not Recommended for New Designs) —
Maximum CPU Clock — 25 MHz
Program Memory (FLASH) — 128 KB (128K x 8)
Data Memory (RAM) — 8 KB (8K x 8)
Number of I/O Pins — 91
Oscillator Type — Internal
Paket / Case — 112-LQFP (20x20 mm)
Terminal Form — GULL WING
Number of Terminals — 112
Package Code — LQFP
Package Shape — SQUARE
Temperature Grade — AUTOMOTIVE
Packaging — Tray

Spek dan Sumber

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