MC9S12E256MPVE vs MC9S12DT256MPVE Perbandingan
Perbandingan bersamaan detil MC9S12E256MPVE dari NXP Semiconductors dan MC9S12DT256MPVE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndPerbandingan Spesifikasi
| Parameter Umum | MC9S12E256MPVE | MC9S12DT256MPVE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | NRND |
| Core | HCS12 | HCS12 (16-bit CISC) |
| Core Size | 16-bit | — |
| Maximum CPU Speed | 25 MHz | — |
| Program Memory | 256 KB Flash | — |
| RAM | 16 KB | 12 KB |
| Paket | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Jumlah Pin | 112 | — |
| Tegangan Pemuat | 5 V single rail (Vreg internal) | 2.35 V to 2.75 V (regulated core) |
| SCI Modules | 3 (asynchronous serial) | — |
| SPI Modules | 1 | — |
| IIC Modules | 1 (Inter-IC Bus) | — |
| Timer Modules | 3 x 16-bit, 4-channel | — |
| ADC | 8-channel, 10-bit | 2 x 10-bit, 8 channels each (16 channels total) |
| PWM Channels | 6 | — |
| Connectivity | EBI/EMI, I2C, SPI, SCI | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | -40C to +125C (automotive grade) |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Maximum CPU Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB |
| EEPROM | — | 4 KB |
| Lebar Bus Data | — | 16-bit |
| I/O Pins | — | 91 |
| Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) |
| Debug Interface | — | Background Debug Mode (BDM) + JTAG |
| Status RoHS | — | Compliant |
| Status Lingkungan Hidup | — | NRND (Not Recommended for New Designs) |