MC9S12E256MPVE vs MC9S12DT256MPVE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12E256MPVE disebabkan oleh NXP Semiconductors dan MC9S12DT256MPVE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndPengandingan Spesifikasi
| Parametr | MC9S12E256MPVE | MC9S12DT256MPVE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | NRND |
| Core | HCS12 | HCS12 (16-bit CISC) |
| Core Size | 16-bit | — |
| Maximum CPU Speed | 25 MHz | — |
| Program Memory | 256 KB Flash | — |
| RAM | 16 KB | 12 KB |
| Kemasan | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Kiraan Pin | 112 | — |
| Tegangan Pemberi Arus | 5 V single rail (Vreg internal) | 2.35 V to 2.75 V (regulated core) |
| SCI Modules | 3 (asynchronous serial) | — |
| SPI Modules | 1 | — |
| IIC Modules | 1 (Inter-IC Bus) | — |
| Timer Modules | 3 x 16-bit, 4-channel | — |
| ADC | 8-channel, 10-bit | 2 x 10-bit, 8 channels each (16 channels total) |
| PWM Channels | 6 | — |
| Connectivity | EBI/EMI, I2C, SPI, SCI | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | -40C to +125C (automotive grade) |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Maximum CPU Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB |
| EEPROM | — | 4 KB |
| Lebar Bus Data | — | 16-bit |
| I/O Pins | — | 91 |
| Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) |
| Debug Interface | — | Background Debug Mode (BDM) + JTAG |
| Status RoHS | — | Compliant |
| Status Lingkungan Hidup | — | NRND (Not Recommended for New Designs) |