MC9S12XDT256CPV vs MC9S12XDT512MAA Perbandingan
Perbandingan bersamaan detil MC9S12XDT256CPV dari NXP Semiconductors dan MC9S12XDT512MAA dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12XDT256CPV - 16-bit HCS12X MCU, 256KB Flash, 112-LQFP | NXP
MC9S12XDT256CPV Nrnd
Perbandingan Spesifikasi
| Parameter Umum | MC9S12XDT256CPV | MC9S12XDT512MAA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core | HCS12X (16-bit CISC with XGATE co-processor) | — |
| Family | S12XD | — |
| Program Memory | 256 KB Flash | — |
| EEPROM | 4 KB | — |
| RAM | 12 KB | — |
| CPU Bus Frequency | 25 MHz / 40 MHz (max) | — |
| XGATE Co-processor | 80 MHz, RISC-style peripheral engine | — |
| Tegangan Pemuat | 2.5 V / 5 V (dual-range) | [DATA_NEEDED: supply voltage range] |
| Paket | 112-LQFP (20 x 20 mm, 0.65 mm pitch) | 80-QFP (14x14 mm), Square, Gull Wing |
| Jumlah Pin | 112 | — |
| Temperature Grade | Industrial (-40C to +85C) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| CAN Modules | Up to 2 x CAN 2.0A/B (msCAN) | — |
| SCI / SPI / I2C | 2 x SCI, 2 x SPI, 1 x I2C | — |
| ADC | 8-channel, 10-bit ATD | — |
| PWM Channels | 4 x 8/16-bit PWM | — |
| Timers | ECT (Enhanced Capture Timer), PIT, RTI | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Suhu Kerja | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Bebas Halogen | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |