MC9S12XDT256CPV vs MC9S12XDT512MAA Karşılaştırma
Ayrıntılı yan yana karşılaştırma MC9S12XDT256CPV tarafından NXP Semiconductors ve MC9S12XDT512MAA tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MC9S12XDT256CPV - 16-bit HCS12X MCU, 256KB Flash, 112-LQFP | NXP
MC9S12XDT256CPV Nrnd
Özellik Karşılaştırması
| Parametre | MC9S12XDT256CPV | MC9S12XDT512MAA |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | NRND | NRND |
| Core | HCS12X (16-bit CISC with XGATE co-processor) | — |
| Family | S12XD | — |
| Program Memory | 256 KB Flash | — |
| EEPROM | 4 KB | — |
| RAM | 12 KB | — |
| CPU Bus Frequency | 25 MHz / 40 MHz (max) | — |
| XGATE Co-processor | 80 MHz, RISC-style peripheral engine | — |
| Besleme Gerilimi | 2.5 V / 5 V (dual-range) | [DATA_NEEDED: supply voltage range] |
| Paket | 112-LQFP (20 x 20 mm, 0.65 mm pitch) | 80-QFP (14x14 mm), Square, Gull Wing |
| Pin Sayısı | 112 | — |
| Temperature Grade | Industrial (-40C to +85C) | — |
| Montaj Türü | Surface Mount | Surface Mount |
| CAN Modules | Up to 2 x CAN 2.0A/B (msCAN) | — |
| SCI / SPI / I2C | 2 x SCI, 2 x SPI, 1 x I2C | — |
| ADC | 8-channel, 10-bit ATD | — |
| PWM Channels | 4 x 8/16-bit PWM | — |
| Timers | ECT (Enhanced Capture Timer), PIT, RTI | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| RoHS Durumu | [DATA_NEEDED: RoHS compliance status] | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| İşletim Sıcaklığı | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Klorürsüz | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |