MC9S12XEQ384CAG vs MC9S12DT256CMPV Perbandingan
Perbandingan bersamaan detil MC9S12XEQ384CAG dari NXP Semiconductors dan MC9S12DT256CMPV dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
MC9S12DT256CMPV ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MC9S12XEQ384CAG | MC9S12DT256CMPV |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | HCS12X (16-bit CISC) | — |
| Core Size | 16-bit | — |
| Bus Speed | 50 MHz | — |
| Co-processor | XGATE RISC co-processor | — |
| Flash Memory | 384 KB (384K x 8) | — |
| RAM Size | 24K x 8 | — |
| EEPROM | Hardware-emulated EEPROM (programmable, flexible) | 4 KB |
| ADC Resolution | 12-bit | — |
| ADC Conversion Time | 3 us | — |
| Timers | Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI) | — |
| Memory Protection | MPU with supervisor/user modes | — |
| I/O Ports | [DATA_NEEDED: I/O Ports count] | — |
| Suhu Kerja | -40C to +85C (TA) | — |
| Tipe Mounting | Surface Mount | Surface Mount (LQFP, gull-wing) |
| Paket | 144-LQFP (20x20 mm) | LQFP-112 |
| Packaging | Tray | — |
| Tegangan Pemuat | [DATA_NEEDED: Supply Voltage] | — |
| Lifecycle Stage | Active | — |
| Core Architecture | — | HCS12 (S12) 16-bit CISC |
| Bus Frequency | — | Up to 50 MHz |
| Program Flash | — | 256 KB |
| RAM | — | 12 KB |
| Jumlah Pin | — | 112 |
| Operating Voltage | — | 5.0 V (4.5 V to 5.5 V) |
| Temperature Grade | — | Automotive (-40C to +125C) |
| ADC | — | 2 x 8-channel 10-bit |
| PWM Channels | — | 8 channels |
| Enhanced Capture Timer | — | 8-channel (ECT) |
| SCI (UART) Interfaces | — | 2 |
| SPI Interfaces | — | 2 |
| CAN Modules | — | 1 x msCAN (CAN 2.0A/B) |
| GPIO (Approx.) | — | 20 discrete digital I/O lines |
| Debug Interface | — | Background Debug Mode (BDM) |
| Status RoHS | — | Compliant (per NXP product page) |