MP3V5004GVP vs MPVZ5010G7U Perbandingan
Perbandingan bersamaan detil MP3V5004GVP dari NXP Semiconductors dan MPVZ5010G7U dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MP3V5004GVP - 0-3.92kPa Gauge Pressure Sensor, 3V, SOP-8 | NXP
MP3V5004GVP ✓ AktifNXP Semiconductors
MPVZ5010G7U - 10 kPa Vented Gauge Pressure Sensor, 8-DIP | NXP
MPVZ5010G7U ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MP3V5004GVP | MPVZ5010G7U |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Aktif |
| Pressure Type | Gauge | Vented Gauge |
| Operating Pressure Range | 0 kPa to 3.92 kPa | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Pressure Resolution | Gage, ratiometric | — |
| Tegangan Pemuat | 2.7 V to 3.3 V (3 V typical) | — |
| Tegangan Output | 0.6 V to 3 V (ratiometric) | — |
| Tipe Output | Analog, ratiometric voltage | Analog, ratiometric to Vcc |
| Accuracy | 5% over 0 to 80 C | ±1.5 %FS (0 °C to 85 °C) |
| Suhu Kerja | 0 C to +85 C | — |
| Pressure Port | Bottom port (Case 482A) | — |
| Paket | SOP-8 (Small Outline Package) | 8-DIP Module (Case 1368-01, through-hole) |
| Tipe Mounting | Surface Mount | Through-Hole (DIP module with vent tube) |
| Media Compatibility | Dry air, non-corrosive gases | — |
| On-Chip Signal Conditioning | Yes (amplification + temperature compensation) | — |
| Calibration | Factory calibrated | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Supply Voltage (Vcc) | — | 4.75 V to 5.25 V (5 V typical) |
| Arus Pemuat | — | 10 mA (maximum) |
| Analog Output Range | — | 0.2 V to 4.7 V |
| Response Time | — | [DATA_NEEDED: response time ms] |
| Rentang Suhu Kerja | — | 0 °C to +85 °C |
| Compensated Temperature Range | — | -10 °C to +60 °C |
| Storage Temperature Range | — | -30 °C to +100 °C [DATA_NEEDED: confirm exact storage spec] |
| Sensor Technology | — | Piezoresistive silicon micromachined |
| Signal Conditioning | — | On-chip, temperature compensated, calibrated |
| Level MSL | — | [DATA_NEEDED: MSL rating] |
| Body Height | — | 5.46 mm |