MPC565MZP56 vs MPCZ565MVR56 Perbandingan
Perbandingan bersamaan detil MPC565MZP56 dari NXP Semiconductors dan MPCZ565MVR56 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC565MZP56 - 56MHz PowerPC MCU 1MB Flash | NXP | 388-PBGA
MPC565MZP56 ⚠ Waktu Beli TerakhirNXP Semiconductors
MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP
MPCZ565MVR56 ObsoletePerbandingan Spesifikasi
| Parameter Umum | MPC565MZP56 | MPCZ565MVR56 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Obsolete |
| Core Architecture | PowerPC MPC5xx (Power Architecture) | Power Architecture (MPC500 family) |
| Core Frequency | 56 MHz | — |
| Lebar Bus Data | 32-bit | 32-bit |
| Program Memory Size | 1 MB (1M x 8) Flash | 1 MB Flash |
| RAM Size | 36 KB SRAM | 64 KB [DATA_NEEDED: exact value] |
| Tegangan Pemuat Kerja | 2.6 V / 5 V | — |
| Paket | 388-PBGA (27x27 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40C to +125C (Automotive) | — |
| Qualification | AEC-Q100 | — |
| FPU | Yes (single-precision floating-point unit) | — |
| CAN Controllers | 2x CAN 2.0B | 2 (CAN 2.0B) |
| ADC | 2x enhanced queued ADC (eQADC) | — |
| Timing Coprocessor | Time Processing Unit (TPU) | — |
| Code Compression | Yes | — |
| Memory Protection | Yes (MPU with ECC) | — |
| Frekuensi Bawah Maximum | — | 40 MHz |
| Supply Voltage Range | — | [DATA_NEEDED: Vdd/Vdd range] |
| Rentang Suhu Kerja | — | -40C to +125C |
| Paket / Case | — | 388-ball PBGA |
| Number of I/O Pins | — | [DATA_NEEDED: exact I/O count] |
| Floating Point Unit | — | Yes (IEEE 754) |
| ADC Channels | — | 40 (QADC) |
| Timers | — | 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] |
| Debug Interface | — | JTAG / OnCE / BDM |
| Tingkat Sensitivitas Kekeringan (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260C (40s max) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Automotive Grade | — | Yes |
| Process Technology | — | 0.25 micron CMOS |