MPC8541ECPXALF vs MPC8541ECVTALF Perbandingan
Perbandingan bersamaan detil MPC8541ECPXALF dari NXP Semiconductors dan MPC8541ECVTALF dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP
MPC8541ECPXALF ✓ AktifNXP Semiconductors
MPC8541ECVTALF - PowerQUICC III 667MHz MPU | 783-FCPBGA | NXP
MPC8541ECVTALF ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MPC8541ECPXALF | MPC8541ECVTALF |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Architecture | PowerPC e500 (Book-E enhanced) | PowerPC e500 |
| Maximum Core Frequency | 667 MHz | — |
| Lebar Bus Data | 64-bit | 32-bit |
| Instruction Set | 32-bit Power Architecture | — |
| L1 Instruction Cache | 32 KB | 32 KB |
| L1 Data Cache | 32 KB | 32 KB |
| L2 Cache | 256 KB | 256 KB unified |
| Core Supply Voltage | 1.2 V (typical) | 1.0 V |
| I/O Supply Voltage | 3.3 V | — |
| Ethernet Controllers | 4x eTSEC (Gigabit) + 2x 10/100 Ethernet (FCC) | — |
| Memory Controller | DDR/DDR2 with ECC | DDR/DDR2 with ECC |
| PCI Express | PCIe x1 / x2 | — |
| Security Engine | SEC 3.0 (DES, 3DES, AES, SHA, MD5, RSA, Kasumi) | DES/3DES, AES, SHA-1/256, MD-5, ARC-4 |
| Paket | 783-FCBGA (29 x 29 mm, 1 mm pitch, flip chip) | 783-FCPBGA (29x29 mm) |
| Suhu Kerja | -40C to +105C | -40C to +105C (extended industrial, ALF grade) |
| Tipe Mounting | Surface Mount | Surface Mount |
| RoHS Compliance | Compliant (lead-free) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | PowerQUICC III, MPC85xx |
| Core Count | — | 1 |
| Core Frequency | — | 667 MHz |
| I/O Voltage | — | 2.5 V / 3.3 V |
| Ethernet | — | Triple-Speed Ethernet (TSEC) with QoS |
| DMA Channels | — | 4 |
| Compliance | — | RoHS [DATA_NEEDED: full status] |