MPC8541ECPXALF vs MPC8541ECVTALF 比較

詳細並排比較 MPC8541ECPXALF 由 NXP Semiconductors 與 MPC8541ECVTALF 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8541ECPXALF MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF ✓ 啟用中
NXP Semiconductors
MPC8541ECVTALF MPC8541ECVTALF - PowerQUICC III 667MHz MPU | 783-FCPBGA | NXP

MPC8541ECVTALF - PowerQUICC III 667MHz MPU | 783-FCPBGA | NXP

MPC8541ECVTALF ✓ 啟用中

規格比較

參數 MPC8541ECPXALF MPC8541ECVTALF
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core Architecture PowerPC e500 (Book-E enhanced) PowerPC e500
Maximum Core Frequency 667 MHz —
資料匯流排寬度 64-bit 32-bit
Instruction Set 32-bit Power Architecture —
L1 Instruction Cache 32 KB 32 KB
L1 Data Cache 32 KB 32 KB
L2 Cache 256 KB 256 KB unified
Core Supply Voltage 1.2 V (typical) 1.0 V
I/O Supply Voltage 3.3 V —
Ethernet Controllers 4x eTSEC (Gigabit) + 2x 10/100 Ethernet (FCC) —
Memory Controller DDR/DDR2 with ECC DDR/DDR2 with ECC
PCI Express PCIe x1 / x2 —
Security Engine SEC 3.0 (DES, 3DES, AES, SHA, MD5, RSA, Kasumi) DES/3DES, AES, SHA-1/256, MD-5, ARC-4
封裝 783-FCBGA (29 x 29 mm, 1 mm pitch, flip chip) 783-FCPBGA (29x29 mm)
工作溫度 -40C to +105C -40C to +105C (extended industrial, ALF grade)
安裝類型 Surface Mount Surface Mount
RoHS Compliance Compliant (lead-free) —
Manufacturer — NXP Semiconductors (formerly Freescale)
Series — PowerQUICC III, MPC85xx
Core Count — 1
Core Frequency — 667 MHz
I/O Voltage — 2.5 V / 3.3 V
Ethernet — Triple-Speed Ethernet (TSEC) with QoS
DMA Channels — 4
Compliance — RoHS [DATA_NEEDED: full status]

資料表與資源

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