MPC8572ECPXAULD vs MPC8572ECVTAVNE Perbandingan

Perbandingan bersamaan detil MPC8572ECPXAULD dari NXP Semiconductors dan MPC8572ECVTAVNE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC8572ECPXAULD MPC8572ECPXAULD - PowerQUICC III Dual-Core SoC 1.333GHz | NXP

MPC8572ECPXAULD - PowerQUICC III Dual-Core SoC 1.333GHz | NXP

MPC8572ECPXAULD Nrnd
NXP Semiconductors
MPC8572ECVTAVNE MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP

MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP

MPC8572ECVTAVNE Nrnd

Perbandingan Spesifikasi

Parameter Umum MPC8572ECPXAULD MPC8572ECVTAVNE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Manufacturer NXP Semiconductors (formerly Freescale) —
Part Family PowerQUICC III (MPC85xx) —
Processor Core PowerPC e500 (dual-core) —
Core Count 2 —
Lebar Bus Data 32-bit —
Frekuensi Bawah Maximum 1.333 GHz —
Tegangan Pemuat Kerja 1.1 V core / 1.8 V / 2.5 V / 3.3 V I/O —
Package Type 1023-ball FCBGA (33 x 33 mm) —
Gaya Mounting Surface Mount (BGA) —
Process Technology 90 nm CMOS 0.09 um CMOS
Instruction Set PowerISA 32-bit —
L2 Cache 512 KB (shared) [DATA_NEEDED: L2 cache size]
Ethernet Controllers 4 x 10/100/1000 Mbps tri-speed MACs with SerDes —
Memory Controller DDR2 / DDR3 with ECC DDR2/DDR3 with ECC (per datasheet family)
Rentang Suhu Kerja Industrial (TBD) [DATA_NEEDED: exact -40C/+85C confirmation] —
Status RoHS Compliant (data-needs verification at supplier page) [DATA_NEEDED: confirm RoHS for this part suffix]
Level MSL [DATA_NEEDED: moisture sensitivity level] —
Processor Type — MPC85xx PowerQUICC III
Core Architecture — PowerPC e500, dual-core, 32-bit RISC
Maximum CPU Clock — 1.5 GHz
Core Voltage — 1.1 V
I/O Voltage — 1.8 V / 2.5 V / 3.3 V
Number of Cores — 2
Ethernet MACs — 4x 10/100/1000 Mbit
PCI Express — 2x PCIe interfaces
Serial RapidIO — 2x endpoints
Security Engine — SEC 4.0 (IPSec/SSL/Kasumi/Snow 3G)
Paket — 1023-ball FCBGA (33x33 mm)
Tipe Mounting — Surface Mount
Suhu Kerja — [DATA_NEEDED: industrial temp grade]

Spek dan Sumber

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