MPC860PCVR66D4 vs MPC860TZQ66D4 Perbandingan
Perbandingan bersamaan detil MPC860PCVR66D4 dari NXP Semiconductors dan MPC860TZQ66D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC860PCVR66D4 - 66MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860PCVR66D4 ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | MPC860PCVR66D4 | MPC860TZQ66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Series | MPC8xx PowerQUICC | — |
| Core Architecture | PowerPC | PowerPC, 32-bit |
| Core Count | 1 (plus CPM RISC engine) | 1 |
| Lebar Bus Data | 32-bit | — |
| Frekuensi Bawah Maximum | 66 MHz | — |
| Tegangan Pemuat Kerja | 3.3 V nominal | — |
| Paket / Case | 357-BBGA (PBGA, 25x25 mm) | 357-PBGA (25x25 mm) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Suhu Kerja | -40C to +95C | 0 °C to +70 °C |
| Level MSL | 3 (168 hours) | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Lead Free Status | Lead Free | Contains Lead |
| Status RoHS | RoHS Compliant | RoHS non-compliant (Contains Lead) |
| REACH Status | REACH Unaffected | — |
| HTSUS | 8542.31.0001 | — |
| Lifecycle | End of Life (NXP product page marks EOL) | — |
| Part Family | — | MPC8xx PowerQUICC |
| Core Frequency | — | 66 MHz |
| Tegangan Pemuat | — | 3.3 V |
| Packaging | — | Tray |
| Communications Module | — | CPM (QUICC Engine) |
| Status Lingkungan Hidup | — | End of Life (per NXP) |
| Kategori | — | Microprocessors - MPU |