MPC860SRVR50D4R2 vs MPC860ENCVR50D4 Perbandingan

Perbandingan bersamaan detil MPC860SRVR50D4R2 dari NXP Semiconductors dan MPC860ENCVR50D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC860SRVR50D4R2 MPC860SRVR50D4R2 - PowerQUICC MPC8xx 50MHz MPU, 357-BGA | NXP

MPC860SRVR50D4R2 - PowerQUICC MPC8xx 50MHz MPU, 357-BGA | NXP

MPC860SRVR50D4R2 ⚠ Waktu Beli Terakhir
NXP Semiconductors
MPC860ENCVR50D4 MPC860ENCVR50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP

MPC860ENCVR50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP

MPC860ENCVR50D4 Nrnd

Perbandingan Spesifikasi

Parameter Umum MPC860SRVR50D4R2 MPC860ENCVR50D4
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Waktu Pembelian Terakhir NRND
Processor Type MPC8xx PowerQUICC, 32-Bit Power Architecture MPU PowerQUICC MPC8xx
Core Count 1 1
Frekuensi Bawah Maximum 50 MHz 50 MHz
Operating Voltage 3.3 V —
Rentang Suhu Kerja 0 C to +95 C [DATA_NEEDED: operating temperature range]
Paket 357-BGA (25 x 25 mm) —
Tipe Mounting Surface Mount Surface Mount
Packaging Tape & Reel (TR) Tray
Lead Free Status Lead Free Lead Free
Process Technology 0.32 um CMOS 0.32 um CMOS
Communications Processor Module Yes (RISC CPM with HDLC, Ethernet, UART) —
Ethernet Interfaces 10/100 Mbps Fast Ethernet (FCC) —
DMA Channels 4 —
Series MPC860 MPC8xx PowerQUICC
Status RoHS Compliant RoHS Compliant
Core Architecture — 32-Bit PowerPC
Tegangan Pemuat Kerja — 3.3 V
Paket / Case — 357-BBGA (PBGA, 25 x 25 mm)
Instruction Cache — 4 KB
Data Cache — 4 KB
On-chip Peripherals — CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC

Spek dan Sumber

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