MPC860SRVR50D4R2 vs MPC860ENCVR50D4 比較

詳細並排比較 MPC860SRVR50D4R2 由 NXP Semiconductors 與 MPC860ENCVR50D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC860SRVR50D4R2 MPC860SRVR50D4R2 - PowerQUICC MPC8xx 50MHz MPU, 357-BGA | NXP

MPC860SRVR50D4R2 - PowerQUICC MPC8xx 50MHz MPU, 357-BGA | NXP

MPC860SRVR50D4R2 ⚠ 最後購買機會
NXP Semiconductors
MPC860ENCVR50D4 MPC860ENCVR50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP

MPC860ENCVR50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP

MPC860ENCVR50D4 Nrnd

規格比較

參數 MPC860SRVR50D4R2 MPC860ENCVR50D4
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 NRND
Processor Type MPC8xx PowerQUICC, 32-Bit Power Architecture MPU PowerQUICC MPC8xx
Core Count 1 1
最大時脈頻率 50 MHz 50 MHz
Operating Voltage 3.3 V —
工作溫度範圍 0 C to +95 C [DATA_NEEDED: operating temperature range]
封裝 357-BGA (25 x 25 mm) —
安裝類型 Surface Mount Surface Mount
Packaging Tape & Reel (TR) Tray
Lead Free Status Lead Free Lead Free
Process Technology 0.32 um CMOS 0.32 um CMOS
Communications Processor Module Yes (RISC CPM with HDLC, Ethernet, UART) —
Ethernet Interfaces 10/100 Mbps Fast Ethernet (FCC) —
DMA Channels 4 —
Series MPC860 MPC8xx PowerQUICC
RoHS 狀態 Compliant RoHS Compliant
Core Architecture — 32-Bit PowerPC
工作電源電壓 — 3.3 V
封裝 / 外殼 — 357-BBGA (PBGA, 25 x 25 mm)
Instruction Cache — 4 KB
Data Cache — 4 KB
On-chip Peripherals — CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC

資料表與資源

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