MPC860TVR80D4 vs MPC860TVR50D4 Perbandingan
Perbandingan bersamaan detil MPC860TVR80D4 dari NXP Semiconductors dan MPC860TVR50D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC860TVR80D4 | MPC860TVR50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Obsolete |
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC | — |
| Core Architecture | PowerPC + CPM (RISC communications processor) | PowerPC 32-bit |
| Core Frequency | 80 MHz | — |
| Operating Voltage | 3.3 V | — |
| Paket / Case | 357-BGA (PBGA 25x25 mm) | 357-PBGA (25x25 mm) |
| Process Technology | 0.32 micrometer CMOS | 0.32 µm CMOS |
| Instruction Cache | 4 KB | 4 Kbyte |
| Data Cache | 4 KB | 4 Kbyte |
| Communication Controllers | 3 FCC, 4 SCC, 2 SMC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| Memory Controller | DRAM, SRAM, Flash, EDO support | DRAM, SRAM, EPROM, Flash |
| Number of Cores | 1 | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | [DATA_NEEDED: rohs compliance] |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Core Count | — | 1 |
| Frekuensi Bawah Maximum | — | 50 MHz |
| Operating Supply Voltage (Core) | — | 3.3 V |
| Operating Supply Voltage (I/O) | — | 3.3 V |
| Integrated Communications Module (CPM) | — | Yes (SCC, SMC, SPI, I²C, UART) |
| PCMCIA Interface | — | Yes (Type I/II) |
| Rentang Suhu Kerja | — | -40°C to +95°C |
| Series | — | MPC8xx PowerQUICC |
| Lead-Free / Reflow Profile | — | [DATA_NEEDED: reflow profile] |