MPC860TVR80D4 vs MPC860TVR50D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860TVR80D4 disebabkan oleh NXP Semiconductors dan MPC860TVR50D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC860TVR80D4 | MPC860TVR50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Obsolete |
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC | — |
| Core Architecture | PowerPC + CPM (RISC communications processor) | PowerPC 32-bit |
| Core Frequency | 80 MHz | — |
| Operating Voltage | 3.3 V | — |
| Kemasan / Case | 357-BGA (PBGA 25x25 mm) | 357-PBGA (25x25 mm) |
| Process Technology | 0.32 micrometer CMOS | 0.32 µm CMOS |
| Instruction Cache | 4 KB | 4 Kbyte |
| Data Cache | 4 KB | 4 Kbyte |
| Communication Controllers | 3 FCC, 4 SCC, 2 SMC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| Memory Controller | DRAM, SRAM, Flash, EDO support | DRAM, SRAM, EPROM, Flash |
| Number of Cores | 1 | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | [DATA_NEEDED: rohs compliance] |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Core Count | — | 1 |
| Frekuensi Klock Maksimum | — | 50 MHz |
| Operating Supply Voltage (Core) | — | 3.3 V |
| Operating Supply Voltage (I/O) | — | 3.3 V |
| Integrated Communications Module (CPM) | — | Yes (SCC, SMC, SPI, I²C, UART) |
| PCMCIA Interface | — | Yes (Type I/II) |
| Gambaran Suhu Operasi | — | -40°C to +95°C |
| Series | — | MPC8xx PowerQUICC |
| Lead-Free / Reflow Profile | — | [DATA_NEEDED: reflow profile] |