MW7IC2240NR1 vs MW7IC2240NBR1 Perbandingan
Perbandingan bersamaan detil MW7IC2240NR1 dari NXP Semiconductors dan MW7IC2240NBR1 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MW7IC2240NR1 | MW7IC2240NBR1 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | RF Amplifiers | RF Amplifiers |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Fungsi | RF Power Amplifier (W-CDMA, multi-stage) | — |
| Technology | LDMOS (Laterally Diffused MOSFET) | RF LDMOS (multi-stage integrated) |
| Frequency Range | 2110 MHz to 2170 MHz (usable 2000-2200 MHz) | 2110 MHz to 2170 MHz (usable 2000-2200 MHz) |
| Average Output Power | 4 W (W-CDMA, 28 V) | — |
| Power Gain (Min) | 15 dB | — |
| Drain Supply Voltage | 24 V to 32 V (28 V typical) | — |
| Input VSWR | 5:1 | 5:1 |
| Output VSWR | 5:1 | 5:1 |
| Nominal Impedance | 50 ohm (DC-blocked input, >3 ohm output) | 50 ohm (on-chip matched) |
| Spurious Emissions | Below -60 dBc from 100 mW to 10 W CW Pout | — |
| On-Chip Matching | Yes (input 50 ohm DC-blocked, partial output) | — |
| Quiescent Current Compensation | Integrated with temperature compensation | — |
| Enable Function | Yes | — |
| Paket | TO-270 WBL-16 (TO-270WB16), 16-pin ceramic | TO-272 WB-16 (over-molded plastic, 16-lead) |
| Operating Modulation Formats | W-CDMA, TD-SCDMA, LTE-FDD, multi-carrier | — |
| Tipe Mounting | Surface Mount / flange mount with ground pad | Surface Mount |
| Modulation / RF Type | — | W-CDMA (also TD-SCDMA, LTE) |
| Output Power (Average) | — | 4 W Avg. @ 2112.5 MHz, single-carrier W-CDMA |
| Supply Voltage (VDD) | — | 28 V (rated 24 V to 32 V operation) |
| Quiescent Current Stage 1 (IDQ1) | — | 90 mA |
| Quiescent Current Stage 2 (IDQ2) | — | 420 mA |
| Minimum Gain | — | 15 dB (typical 30 dB) |
| P1dB (Output) | — | 46 dBm (per distributor listing) |
| Terminal Finish | — | Matte Tin (Sn) |
| Package Body Material | — | Plastic / Epoxy |
| Operating Mode | — | 100% PAR tested for W-CDMA-like signals |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance] |