P1012NSE2HFB vs P1012NSN2HFB Perbandingan
Perbandingan bersamaan detil P1012NSE2HFB dari NXP Semiconductors dan P1012NSN2HFB dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP
P1012NSE2HFB ⚠ Waktu Beli TerakhirNXP Semiconductors
P1012NSN2HFB - QorIQ P1012 800MHz e500v2 MPU | NXP | Networking
P1012NSN2HFB ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | P1012NSE2HFB | P1012NSN2HFB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Processor Series | QorIQ P1 | — |
| Processor Core | PowerPC e500v2 | — |
| Number of Cores | 1 | 1 |
| Core Architecture | 32-Bit Power Architecture | 32-bit |
| Maximum Core Frequency | 800 MHz | — |
| Process Technology | 45 nm CMOS | 45 nm |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet | Integrated GbE (multiple MACs) | GbE (10/100/1000 Mbps) |
| PCIe Controllers | PCIe Gen 2 (x1/x2/x4) | — |
| USB | USB 2.0 (host + device) | USB 2.0 (dual port) |
| TDM Interfaces | 4 (T1/E1) | — |
| QUICC Engine (QE) | Yes (protocol offload) | — |
| SEC Security Accelerator | SEC 4.0 | — |
| Paket | 689-TEPBGA II (31x31 mm) with exposed thermal pad | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Operating Temperature (Tj) | 0C to +125C | — |
| Status RoHS | RoHS Compliant | RoHS Compliant |
| Lead Free Status | Lead Free | Lead Free |
| Packaging | Tray | Tray |
| Manufacturer | — | NXP Semiconductors |
| Series | — | QorIQ P1 |
| Core Processor | — | PowerPC e500v2 |
| Speed | — | 800 MHz |
| Co-processors / DSP | — | QUICC Engine (QE) |
| Connectivity | — | Ethernet, PCIe, USB, TDM, UART, I2C, SPI |
| PCIe | — | PCIe Gen1 (x1/x2) |
| Paket / Case | — | 689-TEPBGA II (31x31 mm) with exposed thermal pad |
| Suhu Kerja | — | 0 C to 125 C |
| Die Revision | — | 1.1 |
| Security | — | Hardware-accelerated cryptography |