P1022NXN2LFB vs P1021NXE2HFB Perbandingan
Perbandingan bersamaan detil P1022NXN2LFB dari NXP Semiconductors dan P1021NXE2HFB dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking
P1022NXN2LFB ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | P1022NXN2LFB | P1021NXE2HFB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Akhir Hidup |
| Architecture | Power Architecture e500 dual-core (RISC, 32-bit) | — |
| Clock Speed (Core) | 1.067 GHz | — |
| Platform Version | 1067/533/667 ET NE r1.1 | — |
| Core Count | 2 | — |
| Package Type | TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) | — |
| Package Dimensions | 31 x 31 mm, 2.23 mm height | — |
| Jumlah Pin | 689 | — |
| Suhu Kerja | -40 °C to +125 °C (industrial) | -40C to +125C (industrial/extended) |
| Tegangan Pemuat | 3.13 V to 3.47 V | — |
| Memory Controller | DDR2/DDR3 with ECC support, up to 32-bit | DDR2/DDR3 with ECC |
| Ethernet MACs | 3 x 10/100/1000 Mbps Gigabit | — |
| PCIe Interfaces | 3 x PCIe Gen1 | — |
| USB | USB 2.0 host/device | USB 2.0 |
| Display Controller | 32-bit LCD controller | — |
| Security Engine | Integrated (symmetric/asymmetric crypto acceleration) | — |
| RoHS Compliance | Yes (halogen-free) | — |
| Tipe Mounting | Surface Mount (BGA, requires thermal via array under die) | — |
| Part Number | — | P1021NXE2HFB |
| Manufacturer | — | NXP Semiconductors |
| Series | — | QorIQ P1 |
| Core Architecture | — | PowerPC e500v2 |
| Number of Cores | — | 2 |
| Core Frequency (Max) | — | 800 MHz |
| Lebar Bus Data | — | 32-bit |
| Ethernet | — | 3x Gigabit Ethernet (GbE) |
| PCIe | — | Yes |
| Security Engine (SEC) | — | Yes (hardware-accelerated) |
| QUICC Engine (QE) | — | Yes, revision r1.1 |
| Paket | — | 689-TEPBGA II (31x31 mm) |
| Process Technology | — | 45 nm |
| Speed Bin | — | 800/400/667 MHz |
| Status Lingkungan Hidup | — | End of Life (per NXP product page) |
| RoHS | — | Compliant (per distributor listings) |