P1022NXN2LFB vs P1021NXE2HFB Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci P1022NXN2LFB disebabkan oleh NXP Semiconductors dan P1021NXE2HFB disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
P1022NXN2LFB P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB ⚠ Bahagian terakhir untuk beli
NXP Semiconductors
P1021NXE2HFB P1021NXE2HFB - QorIQ Dual-Core 800MHz SoC | NXP

P1021NXE2HFB - QorIQ Dual-Core 800MHz SoC | NXP

P1021NXE2HFB ✗ Akhir Hayat

Pengandingan Spesifikasi

Parametr P1022NXN2LFB P1021NXE2HFB
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Masa Terakhir Dibeli Akhir Hidup
Architecture Power Architecture e500 dual-core (RISC, 32-bit) —
Clock Speed (Core) 1.067 GHz —
Platform Version 1067/533/667 ET NE r1.1 —
Core Count 2 —
Package Type TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) —
Package Dimensions 31 x 31 mm, 2.23 mm height —
Kiraan Pin 689 —
Suhu Operasi -40 °C to +125 °C (industrial) -40C to +125C (industrial/extended)
Tegangan Pemberi Arus 3.13 V to 3.47 V —
Memory Controller DDR2/DDR3 with ECC support, up to 32-bit DDR2/DDR3 with ECC
Ethernet MACs 3 x 10/100/1000 Mbps Gigabit —
PCIe Interfaces 3 x PCIe Gen1 —
USB USB 2.0 host/device USB 2.0
Display Controller 32-bit LCD controller —
Security Engine Integrated (symmetric/asymmetric crypto acceleration) —
RoHS Compliance Yes (halogen-free) —
Jenis Pemasangan Surface Mount (BGA, requires thermal via array under die) —
Part Number — P1021NXE2HFB
Manufacturer — NXP Semiconductors
Series — QorIQ P1
Core Architecture — PowerPC e500v2
Number of Cores — 2
Core Frequency (Max) — 800 MHz
Lebar Bus Data — 32-bit
Ethernet — 3x Gigabit Ethernet (GbE)
PCIe — Yes
Security Engine (SEC) — Yes (hardware-accelerated)
QUICC Engine (QE) — Yes, revision r1.1
Kemasan — 689-TEPBGA II (31x31 mm)
Process Technology — 45 nm
Speed Bin — 800/400/667 MHz
Status Lingkungan Hidup — End of Life (per NXP product page)
RoHS — Compliant (per distributor listings)

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