S9S08AW60E5MFGE vs MC9S08AW48CFDE Perbandingan
Perbandingan bersamaan detil S9S08AW60E5MFGE dari NXP Semiconductors dan MC9S08AW48CFDE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ Aktif
Perbandingan Spesifikasi
| Parameter Umum | S9S08AW60E5MFGE | MC9S08AW48CFDE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tegangan Pemuat | 3 V / 3.3 V / 5 V | — |
| Paket | 44-pin LQFP (10 x 10 mm) | 48-QFN-EP (7 x 7 mm) |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 10-bit |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | BDM (Background Debug Mode) |
| Suhu Kerja | -40C to +125C (automotive range) | -40C to +85C |
| Tipe Mounting | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core | — | HCS08 (enhanced S08) |
| Lebar Bus Data | — | 8 bit |
| Program Memory Size | — | 48 KB Flash |
| RAM Size | — | 2 KB |
| Frekuensi Bawah Maximum | — | 40 MHz |
| Supply Voltage Range | — | 2.7 V to 5.5 V (3.3 V / 5 V) |
| Communication Interfaces | — | SCI, SPI, I2C |
| Instruction Set | — | CISC |
| Level MSL | — | [DATA_NEEDED: MSL rating] |
| Status RoHS | — | Compliant |
| Lead Free | — | Yes |