S9S08AW60E5MFGE vs MC9S08AW48CFDE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S08AW60E5MFGE disebabkan oleh NXP Semiconductors dan MC9S08AW48CFDE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ Aktif
Pengandingan Spesifikasi
| Parametr | S9S08AW60E5MFGE | MC9S08AW48CFDE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tegangan Pemberi Arus | 3 V / 3.3 V / 5 V | — |
| Kemasan | 44-pin LQFP (10 x 10 mm) | 48-QFN-EP (7 x 7 mm) |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 10-bit |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | BDM (Background Debug Mode) |
| Suhu Operasi | -40C to +125C (automotive range) | -40C to +85C |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core | — | HCS08 (enhanced S08) |
| Lebar Bus Data | — | 8 bit |
| Program Memory Size | — | 48 KB Flash |
| RAM Size | — | 2 KB |
| Frekuensi Klock Maksimum | — | 40 MHz |
| Supply Voltage Range | — | 2.7 V to 5.5 V (3.3 V / 5 V) |
| Communication Interfaces | — | SCI, SPI, I2C |
| Instruction Set | — | CISC |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Status RoHS | — | Compliant |
| Lead Free | — | Yes |