SM2263XT vs SM2262EN Perbandingan

Perbandingan bersamaan detil SM2263XT dari Silicon Motion Technology Corp. dan SM2262EN dari Silicon Motion Technology Corp.. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Silicon Motion Technology Corp.
SM2263XT SM2263XT - PCIe Gen3 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2263XT - PCIe Gen3 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2263XT ✓ Aktif
Silicon Motion Technology Corp.
SM2262EN SM2262EN - PCIe 3.1 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2262EN - PCIe 3.1 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2262EN ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum SM2263XT SM2262EN
Merek Silicon Motion Technology Corp. Silicon Motion Technology Corp.
Kategori Interface ICs Memory ICs
Status Lingkungan Hidup Aktif Aktif
Product Type PCIe Gen3 x4 NVMe 1.3 SSD Controller (DRAMless) PCIe NVMe SSD controller
Manufacturer Silicon Motion Technology Corp. —
Host Interface PCIe Gen3 x4 (NVMe 1.3) PCIe
PCIe Lanes 4 lanes (8 Gbps each) —
NAND Channels 4 channels 8 channels
CE per Channel 4 CE/ch (per third-party SSD teardowns) —
DRAM Cache None (DRAMless; uses NVMe HMB) —
Host Memory Buffer Supported (NVMe HMB feature) —
NAND Support 2D/3D MLC, TLC, QLC; SLC cache —
ECC LDPC hard-decision + soft-decision —
Data Protection End-to-end CRC, hardware RAID —
Encryption AES-256 hardware encryption —
Sequential Read (typical OEM drive) up to 2400 MB/s —
Sequential Write (typical OEM drive) up to 1700 MB/s —
Paket BGA (SSD controller; pinout varies by OEM reference design) —
Tipe Mounting Surface Mount (reflow, OEM SSD assembly only) —
Status RoHS Compliant (per Silicon Motion product brief) [DATA_NEEDED: RoHS status]
Availability Channel OEM only (not via catalog distributor) —
Typical OEM Capacities 256 GB to 1 TB (M.2 2280 single-sided) —
PCIe Generation — PCIe 3.1
PCIe Lane Configuration — x4
Per-Lane Data Rate — 8 Gbps
NVMe Specification — NVMe 1.3
Process Node — 28 nm TSMC
Architecture — DRAM-less
Package Type — BGA package
Application — PCIe SSD
Storage Protocol — NVMe
Manufacturer Product Brief — SM2262EN product brief
NAND Interface Details — [DATA_NEEDED: NAND interface details]
Maximum Storage Capacity — [DATA_NEEDED: maximum storage capacity]
Rentang Suhu Kerja — [DATA_NEEDED: operating temperature range]
Core Supply Voltage — [DATA_NEEDED: core supply voltage]
I/O Supply Voltage — [DATA_NEEDED: I/O supply voltage]
Package Dimensions — [DATA_NEEDED: package dimensions]
Jumlah Pin — [DATA_NEEDED: pin count]
REACH Status — [DATA_NEEDED: REACH status]
Automotive Qualification — [DATA_NEEDED: automotive qualification]

Spek dan Sumber

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