SM2263XT vs SM2262EN Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci SM2263XT disebabkan oleh Silicon Motion Technology Corp. dan SM2262EN disebabkan oleh Silicon Motion Technology Corp.. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Silicon Motion Technology Corp.
SM2263XT - PCIe Gen3 x4 NVMe 1.3 SSD Controller | Silicon Motion
SM2263XT ✓ AktifSilicon Motion Technology Corp.
SM2262EN - PCIe 3.1 x4 NVMe 1.3 SSD Controller | Silicon Motion
SM2262EN ✓ AktifPengandingan Spesifikasi
| Parametr | SM2263XT | SM2262EN |
|---|---|---|
| Merek | Silicon Motion Technology Corp. | Silicon Motion Technology Corp. |
| Kategori | Interface ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | PCIe Gen3 x4 NVMe 1.3 SSD Controller (DRAMless) | PCIe NVMe SSD controller |
| Manufacturer | Silicon Motion Technology Corp. | — |
| Host Interface | PCIe Gen3 x4 (NVMe 1.3) | PCIe |
| PCIe Lanes | 4 lanes (8 Gbps each) | — |
| NAND Channels | 4 channels | 8 channels |
| CE per Channel | 4 CE/ch (per third-party SSD teardowns) | — |
| DRAM Cache | None (DRAMless; uses NVMe HMB) | — |
| Host Memory Buffer | Supported (NVMe HMB feature) | — |
| NAND Support | 2D/3D MLC, TLC, QLC; SLC cache | — |
| ECC | LDPC hard-decision + soft-decision | — |
| Data Protection | End-to-end CRC, hardware RAID | — |
| Encryption | AES-256 hardware encryption | — |
| Sequential Read (typical OEM drive) | up to 2400 MB/s | — |
| Sequential Write (typical OEM drive) | up to 1700 MB/s | — |
| Kemasan | BGA (SSD controller; pinout varies by OEM reference design) | — |
| Jenis Pemasangan | Surface Mount (reflow, OEM SSD assembly only) | — |
| Status RoHS | Compliant (per Silicon Motion product brief) | [DATA_NEEDED: RoHS status] |
| Availability Channel | OEM only (not via catalog distributor) | — |
| Typical OEM Capacities | 256 GB to 1 TB (M.2 2280 single-sided) | — |
| PCIe Generation | — | PCIe 3.1 |
| PCIe Lane Configuration | — | x4 |
| Per-Lane Data Rate | — | 8 Gbps |
| NVMe Specification | — | NVMe 1.3 |
| Process Node | — | 28 nm TSMC |
| Architecture | — | DRAM-less |
| Package Type | — | BGA package |
| Application | — | PCIe SSD |
| Storage Protocol | — | NVMe |
| Manufacturer Product Brief | — | SM2262EN product brief |
| NAND Interface Details | — | [DATA_NEEDED: NAND interface details] |
| Maximum Storage Capacity | — | [DATA_NEEDED: maximum storage capacity] |
| Gambaran Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Kiraan Pin | — | [DATA_NEEDED: pin count] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Automotive Qualification | — | [DATA_NEEDED: automotive qualification] |