SPC5603BF2MLL4R vs SPC5553MVR132 Perbandingan
Perbandingan bersamaan detil SPC5603BF2MLL4R dari NXP Semiconductors dan SPC5553MVR132 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
SPC5603BF2MLL4R - 32-bit Automotive MCU, 384KB Flash, 48MHz | NXP
SPC5603BF2MLL4R ✓ AktifNXP Semiconductors
SPC5553MVR132 - 32-bit PowerPC MCU, 132MHz, 1.5MB Flash | NXP
SPC5553MVR132 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | SPC5603BF2MLL4R | SPC5553MVR132 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Architecture | Power Architecture e200z0h | — |
| Bit Width | 32-bit | — |
| Maximum CPU Frequency | 48 MHz | — |
| Program Flash Memory | 384 KB (384K x 8) | — |
| Rentang Suhu Kerja | -40 C to +125 C (Automotive Grade) | — |
| Package Type | 100-LQFP (LFQFP, 14x14 mm) | — |
| Lead Finish / Terminal Form | Gull Wing | — |
| Number of Terminals | 100 | — |
| Package Shape | Square | — |
| Series | Qorivva MPC56xx | MPC55xx Qorivva |
| Tegangan Pemuat | [DATA_NEEDED: supply voltage range] | 1.8 V / 2.5 V / 3.3 V / 5 V (mixed I/O) |
| RAM Size | [DATA_NEEDED: SRAM size] | 64 KB (64K x 8) |
| Communication Interfaces | CAN, SPI, SCI/UART, I2C (peripherals) | — |
| Debug Interface | JTAG / Nexus | — |
| Qualification | AEC-Q100 (Automotive Grade) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Core | — | e200z6 Power Architecture, 32-bit, single-issue |
| CPU Frequency | — | 132 MHz |
| Program Memory (Flash) | — | 1.5 MB (1.5M x 8) |
| Number of I/O | — | 220 |
| Paket / Case | — | 416-BBGA (27 mm x 27 mm) |
| Oscillator Type | — | External |
| Suhu Kerja | — | -40 C to +125 C (automotive grade) |
| Packaging | — | Tray |
| Connectivity | — | 2x CAN 2.0B, 2x FlexRay, SPI, SCI, I2C |
| Peripherals | — | eTPU, eDMA, 12-bit SAR ADC, EBI |