SPC5603BF2MLL4R vs SPC5553MVR132 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci SPC5603BF2MLL4R disebabkan oleh NXP Semiconductors dan SPC5553MVR132 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
SPC5603BF2MLL4R - 32-bit Automotive MCU, 384KB Flash, 48MHz | NXP
SPC5603BF2MLL4R ✓ AktifNXP Semiconductors
SPC5553MVR132 - 32-bit PowerPC MCU, 132MHz, 1.5MB Flash | NXP
SPC5553MVR132 ✓ AktifPengandingan Spesifikasi
| Parametr | SPC5603BF2MLL4R | SPC5553MVR132 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Architecture | Power Architecture e200z0h | — |
| Bit Width | 32-bit | — |
| Maximum CPU Frequency | 48 MHz | — |
| Program Flash Memory | 384 KB (384K x 8) | — |
| Gambaran Suhu Operasi | -40 C to +125 C (Automotive Grade) | — |
| Package Type | 100-LQFP (LFQFP, 14x14 mm) | — |
| Lead Finish / Terminal Form | Gull Wing | — |
| Number of Terminals | 100 | — |
| Package Shape | Square | — |
| Series | Qorivva MPC56xx | MPC55xx Qorivva |
| Tegangan Pemberi Arus | [DATA_NEEDED: supply voltage range] | 1.8 V / 2.5 V / 3.3 V / 5 V (mixed I/O) |
| RAM Size | [DATA_NEEDED: SRAM size] | 64 KB (64K x 8) |
| Communication Interfaces | CAN, SPI, SCI/UART, I2C (peripherals) | — |
| Debug Interface | JTAG / Nexus | — |
| Qualification | AEC-Q100 (Automotive Grade) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Core | — | e200z6 Power Architecture, 32-bit, single-issue |
| CPU Frequency | — | 132 MHz |
| Program Memory (Flash) | — | 1.5 MB (1.5M x 8) |
| Number of I/O | — | 220 |
| Kemasan / Case | — | 416-BBGA (27 mm x 27 mm) |
| Oscillator Type | — | External |
| Suhu Operasi | — | -40 C to +125 C (automotive grade) |
| Packaging | — | Tray |
| Connectivity | — | 2x CAN 2.0B, 2x FlexRay, SPI, SCI, I2C |
| Peripherals | — | eTPU, eDMA, 12-bit SAR ADC, EBI |