Microchip Technology

A3P600L-FG144I - 600K Gate ProASIC3L FPGA | Microchip Technology

MPN: A3P600L-FG144I ✓ Aktif
1.2 V to 1.5 V Vdss 144-LBGA (13x13 mm, 1.45 mm height, 1 mm pitch) Package 350 MHz Speed
MOQ: 1 |

A3P600L-FG144I Ringkasan

The Microchip Technology A3P600L-FG144I is a low-power flash-based Field Programmable Gate Array (FPGA) from the ProASIC3L family, offering 600K system gates, 13,824 logic elements, and 97 user I/Os in a 144-ball LBGA (13x13 mm, 1.45 mm height, 1 mm pitch) package. It operates from a 1.2 V to 1.5 V core supply and supports a maximum internal frequency of 350 MHz, making it suitable for a wide range of low-power, high-reliability applications.

An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without the cost and time of a new chip fabrication run. The ProASIC3L family uses nonvolatile flash technology, which provides instant-on operation, low power consumption, and enhanced security compared to SRAM-based FPGAs. This places the A3P600L-FG144I within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.

Key features of the A3P600L-FG144I include 600K system gates, 13,824 logic elements (equivalent to 7K LEs per Mouser), 97 user I/Os, and 110,592 bits of RAM. The device supports multiple I/O standards, including LVCMOS, LVTTL, and PCI, and offers up to 350 MHz performance. Its low-power flash architecture consumes significantly less static power than SRAM-based FPGAs, making it ideal for battery-powered and thermally constrained designs. The industrial temperature grade (-40°C to +100°C) ensures reliable operation in harsh environments.

Technically, the A3P600L-FG144I is built on a 130 nm flash process, which enables a single-chip, secure, and instant-on solution. The flash-based configuration memory is nonvolatile, meaning the device retains its programming even without power, eliminating the need for external configuration memory and reducing system cost and complexity. The device also supports in-system programming (ISP) and partial reconfiguration, providing flexibility for field updates and design iterations.

Typical applications for the A3P600L-FG144I include industrial control systems, automotive electronics, communications infrastructure, and medical devices. Its low power consumption and instant-on capability make it particularly well-suited for portable and battery-operated equipment, while its security features protect intellectual property from unauthorized copying. The 97 I/Os allow interfacing with a variety of peripherals and memory devices.

When designing with this FPGA, consider the core voltage requirement of 1.2 V to 1.5 V and ensure adequate decoupling capacitors are placed near the power pins. The device supports multiple I/O banks, each with its own supply voltage, allowing flexible voltage level translation. Proper PCB layout, including controlled impedance traces for high-speed signals, is essential to achieve the rated 350 MHz performance.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for selecting and implementing the A3P600L-FG144I in their designs.

Alternatif penggantian untuk A3P600L-FG144I — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian A3P600L-FG144I (sama faktor bentuk dan footprint) — berbeda di dalam Package, Operating Temperature, Technology, RoHS Status, Family.

Microchip Technology
RoHS Status: Compliant
Bandingkan dengan A3P600L-FG144I →
Microchip Technology
Package: 144-LBGA (FBGA-144)
Operating Temperature: -40C to +100C (TJ), industrial
Technology: 130 nm flash-based
Bandingkan dengan A3P600L-FG144I →
Microchip Technology
Package: 144-LBGA (13x13mm, 1mm pitch)
Technology: CMOS 130nm
RoHS Status: Compliant (Green)
Bandingkan dengan A3P600L-FG144I →
Microchip Technology
Package: 144-LBGA (FBGA-144 / FGG144)
Operating Temperature: -40C to +100C (TJ), Industrial
Technology: CMOS Flash (non-volatile)
Bandingkan dengan A3P600L-FG144I →
Microchip Technology
Package: 144-ball FBGA (FG144), 13 x 13 mm, 1.0 mm pitch, 1.45 mm height
Operating Temperature: 0C to +85C (commercial, -F grade)
Family: ProASIC3L (Flash FPGA)
Bandingkan dengan A3P600L-FG144I →
Microchip Technology
Package: 144-LBGA (FGG144)
Operating Temperature: 0C to +85C (TJ)
Technology: Flash-based (nonvolatile)
Bandingkan dengan A3P600L-FG144I →
Microchip Technology
Package: 144-LBGA (FGG144, 13x13 mm)
Operating Temperature: -40C to +100C (TJ)
Bandingkan dengan A3P600L-FG144I →

A3P600L-FGG144I

✅ Drop-In
Microchip Technology
📦 144-LBGA
ProASIC3L · Flash-based (non-volatile) · 600000 · 110592 · 97 · 1.14 V to 1.575 V · 1.2 V / 1.5 V · -40C to +100C (TJ)

Kontak untuk harga

Lihat Datasheet →

A3P600L-FG144

✅ Drop-In
Microchip Technology
📦 144-LBGA
ProASIC3L (Flash FPGA) · 600000 · 13824 · 97 · 1.2 V to 1.5 V · Nonvolatile Flash (single-chip) · 110592 bits · 250 MHz

Kontak untuk harga

Lihat Datasheet →

A3P600-FG144I

✅ Drop-In
Microchip Technology
📦 144-LBGA
600000 · 13824 · 350 MHz · 97 · FBGA-144, 1 mm pitch · CMOS · 144 · -40°C to +100°C (industrial)

Kontak untuk harga

Lihat Datasheet →

A3P600L-FGG144

✅ Drop-In
Microchip Technology
📦 144-LBGA
ProASIC3L · 600000 gates · 97 · 110592 bits · 1.14 V to 1.575 V · 1.2 V to 1.5 V · Flash-based (nonvolatile) · Yes (LAPU)

Kontak untuk harga

Lihat Datasheet →
ℹ️ 1 bagian yang disembunyikan di dalam paket lain — paket yang berbeda memerlukan kerja ulang PCB dan bukan pengganti yang benar Kontak kami jika Anda memerlukan saran paket yang berbeda.

A3P600L-FG144I Rating Maksimal & Karakteristik Listrik

Family ProASIC3L
System Gates 600000
Logic Elements 13824
User I/Os 97
RAM Bits 110592
Core Voltage 1.2 V to 1.5 V
Maximum Internal Frequency 350 MHz
Technology 130 nm Flash
Paket 144-LBGA (13x13 mm, 1.45 mm height, 1 mm pitch)
Tipe Mounting Surface Mount
Suhu Kerja -40°C to +100°C (Industrial)
Number of Terminals 144
Package Code LBGA
Status RoHS Compliant
REACH Status Compliant

Konfigurasi Pin A3P600L-FG144I

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin produk 1 IO — User I/O
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Pin produk 97 IO — User I/O
Pin produk 98 VCC — Core power supply
Pin produk 99 GND — Ground
Pin produk 100 VCC — Core power supply
Pin produk 101 GND — Ground
Pin produk 102 VCC — Core power supply
Pin produk 103 GND — Ground
Pin produk 104 VCC — Core power supply
Pin produk 105 GND — Ground
Pin produk 106 VCC — Core power supply
Pin produk 107 GND — Ground
Pin produk 108 VCC — Core power supply
Pin produk 109 GND — Ground
Pin produk 110 VCC — Core power supply
Pin produk 111 GND — Ground
Pin produk 112 VCC — Core power supply
Pin produk 113 GND — Ground
Pin produk 114 VCC — Core power supply
Pin produk 115 GND — Ground
Pin produk 116 VCC — Core power supply
Pin produk 117 GND — Ground
Pin produk 118 VCC — Core power supply
Pin produk 119 GND — Ground
Pin produk 120 VCC — Core power supply
Pin produk 121 GND — Ground
Pin produk 122 VCC — Core power supply
Pin produk 123 GND — Ground
Pin produk 124 VCC — Core power supply
Pin produk 125 GND — Ground
Pin produk 126 VCC — Core power supply
Pin produk 127 GND — Ground
Pin produk 128 VCC — Core power supply
Pin produk 129 GND — Ground
Pin produk 130 VCC — Core power supply
Pin produk 131 GND — Ground
Pin produk 132 VCC — Core power supply
Pin produk 133 GND — Ground
Pin produk 134 VCC — Core power supply
Pin produk 135 GND — Ground
Pin produk 136 VCC — Core power supply
Pin produk 137 GND — Ground
Pin produk 138 VCC — Core power supply
Pin produk 139 GND — Ground
Pin produk 140 VCC — Core power supply
Pin produk 141 GND — Ground
Pin produk 142 VCC — Core power supply
Pin produk 143 GND — Ground
Pin produk 144 VCC — Core power supply

Aplikasi Umum

A3P600L-FG144I cocok untuk 6 aplikasis: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Medical Devices, Aerospace and Defense, IoT and Smart Devices.

🏭

Industrial Control Systems

The A3P600L-FG144I is ideal for industrial control systems due to its low power consumption, instant-on capability, and wide operating temperature range (-40°C to +100°C). Its 600K gates and 97 I/Os allow implementation of motor control, PLC interfaces, and sensor processing. The flash-based architecture ensures secure and reliable operation in harsh environments, with no external configuration memory required. The device's 1.2V core voltage reduces power dissipation, making it suitable for distributed control nodes. With up to 350 MHz performance, it can handle real-time control loops and communication protocols. The 144-LBGA package is compact, fitting space-constrained industrial PCBs. Recommended companion products include the A3P600L-FGG144I for lead-free designs and the A3P600-FG144I for higher core voltage applications.

🚗

Automotive Electronics

The A3P600L-FG144I is suitable for automotive electronics such as infotainment systems, advanced driver-assistance systems (ADAS), and body control modules. Its industrial temperature range (-40°C to +100°C) covers most automotive environments, and its low power consumption is beneficial for battery-powered vehicles. The flash-based FPGA provides instant-on operation, critical for safety systems that must start immediately. With 97 I/Os, it can interface with sensors, CAN transceivers, and displays. The 600K gates allow implementation of custom logic for signal processing and control. However, it is not AEC-Q100 qualified, so for strict automotive certification, consider the A3P600L-FGG144I or other qualified parts. The 144-LBGA package is robust for automotive PCB assemblies.

🌐

Communications Infrastructure

The A3P600L-FG144I is well-suited for communications infrastructure, including base stations, routers, and network switches. Its 350 MHz performance and 97 I/Os enable implementation of protocol converters, packet processing, and interface bridging. The low power consumption is critical for remote and energy-efficient installations. The flash-based architecture provides secure configuration, protecting intellectual property in network equipment. The 600K gates allow integration of multiple functions, reducing board space and cost. The 144-LBGA package is suitable for high-density PCBs. For designs requiring lead-free compliance, the A3P600L-FGG144I is a direct drop-in. The device's instant-on capability ensures rapid startup in network equipment.

💊

Medical Devices

The A3P600L-FG144I is ideal for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its low power consumption extends battery life in portable devices, and its instant-on capability ensures immediate operation. The industrial temperature range (-40°C to +100°C) covers clinical environments. The flash-based FPGA provides secure and reliable configuration, essential for medical applications. With 600K gates and 97 I/Os, it can handle sensor interfacing, signal processing, and display control. The 144-LBGA package is compact for space-constrained medical PCBs. For lead-free requirements, the A3P600L-FGG144I is a drop-in alternative. The device's low static power reduces heat generation, improving reliability in enclosed medical housings.

✈️

Aerospace and Defense

The A3P600L-FG144I is suitable for aerospace and defense applications, including avionics, satellite systems, and secure communications. Its flash-based architecture provides inherent security against reverse engineering, critical for defense systems. The industrial temperature range (-40°C to +100°C) covers many aerospace environments, though extreme conditions may require extended temperature grades. The low power consumption is beneficial for satellite and UAV applications where power is limited. With 600K gates and 97 I/Os, it can implement custom processing and interface logic. The instant-on capability ensures immediate operation in mission-critical systems. For lead-free requirements, the A3P600L-FGG144I is a drop-in alternative. The 144-LBGA package is rugged and suitable for harsh environments.

🧩

IoT and Smart Devices

The A3P600L-FG144I is well-suited for IoT and smart devices, including smart home controllers, industrial IoT gateways, and wearable devices. Its low power consumption is essential for battery-powered IoT nodes, and its instant-on capability allows quick wake-up from sleep modes. The flash-based FPGA provides secure configuration, protecting IoT devices from unauthorized access. With 600K gates and 97 I/Os, it can handle sensor fusion, protocol handling, and edge processing. The 144-LBGA package is compact for small form-factor devices. The industrial temperature range (-40°C to +100°C) covers outdoor IoT deployments. For lead-free designs, the A3P600L-FGG144I is a drop-in alternative. The device's low static power extends battery life in always-on IoT applications.

What is the A3P600L-FG144I?
The A3P600L-FG144I is a low-power flash-based FPGA from Microchip Technology's ProASIC3L family, offering 600K system gates, 13,824 logic elements, and 97 user I/Os in a 144-ball LBGA package. It operates from a 1.2V to 1.5V core supply and supports up to 350 MHz internal frequency. According to the ProASIC3 Flash Family datasheet (DS50003269), it is a single-chip, instant-on, secure solution ideal for low-power applications.
What is the price of A3P600L-FG144I?
As of 2026-08-31, the A3P600L-FG144I is priced at approximately $51.46 for a single unit, with volume pricing dropping to around $35.20 at 1000 units, based on LCSC and distributor data. Prices vary by distributor and quantity, so it is advisable to check current quotes from DigiKey, Mouser, or Octopart for the most accurate pricing.
Where can I buy A3P600L-FG144I?
The A3P600L-FG144I is available from major distributors including DigiKey, Mouser, LCSC, and Heisener. As of 2026-08-31, DigiKey lists it as 'ships today', and LCSC shows it in stock. You can also request quotes from Octopart, which aggregates availability from multiple distributors. For bulk orders, contacting Microchip directly or authorized distributors is recommended.
What is the lead time for A3P600L-FG144I?
The lead time for A3P600L-FG144I varies by distributor and stock levels. As of 2026-08-31, DigiKey indicates it ships today, while Heisener lists a lead time 'to be confirmed' with estimated delivery in October 2026. For large quantities, lead times may extend to several weeks. It is best to check with your preferred distributor for current lead time information.
Is A3P600L-FG144I in stock?
Yes, as of 2026-08-31, the A3P600L-FG144I is in stock at several distributors. DigiKey lists it as 'ships today', LCSC shows it in stock, and Heisener reports 5,872 pieces available. However, stock levels change frequently, so it is recommended to verify availability on distributor websites before placing an order.
What is the difference between A3P600L-FG144I and A3P600-FG144I?
The A3P600L-FG144I is a low-power variant of the A3P600-FG144I, with a core voltage of 1.2V to 1.5V compared to the standard A3P600's 1.5V core. The 'L' suffix indicates lower power consumption, making it suitable for battery-powered applications. Both share the same 144-LBGA package and 97 I/Os, but the A3P600L typically has lower static power. According to etei.com comparison, they differ in power characteristics and possibly speed grades.
What is the difference between A3P600L-FG144I and A3P600L-FGG144I?
The A3P600L-FG144I and A3P600L-FGG144I are essentially the same FPGA, but the 'G' in FGG144I indicates a lead-free (RoHS-compliant) package finish. Both have the same 144-ball LBGA package, 600K gates, and 97 I/Os. The FGG variant is fully RoHS compliant, while the FG variant may have lead-based solder balls. For new designs, the FGG version is often preferred due to environmental regulations.
What is the best drop-in replacement for A3P600L-FG144I?
The best drop-in replacement for A3P600L-FG144I is the A3P600L-FGG144I, which is pin-to-pin compatible and shares the same 144-LBGA package, 600K gates, and 97 I/Os. The FGG variant is lead-free and RoHS compliant, making it a direct substitute. Other alternatives include the A3P600L-FG144 (non-industrial temperature) and A3P600L-FG256I (different package, not drop-in). Always verify pin compatibility before substitution.
Can A3P600-FG144I replace A3P600L-FG144I?
Yes, the A3P600-FG144I can replace the A3P600L-FG144I in most applications, as they share the same 144-LBGA package and pinout. However, the A3P600-FG144I has a higher core voltage (1.5V) and higher power consumption, so it is not a drop-in replacement for low-power designs. If power is not a concern, it can be used, but verify the core voltage compatibility with your power supply.
What are the key specifications of A3P600L-FG144I that engineers should know?
Engineers should know that the A3P600L-FG144I has 600K system gates, 13,824 logic elements, 97 user I/Os, and 110,592 bits of RAM. It operates from a 1.2V to 1.5V core supply, supports up to 350 MHz internal frequency, and comes in a 144-ball LBGA package. It is a flash-based FPGA with instant-on capability, low power consumption, and industrial temperature range (-40°C to +100°C). These specs make it ideal for low-power, secure, and reliable applications.
Where can I download the A3P600L-FG144I datasheet PDF?
The A3P600L-FG144I datasheet is available from Microchip's official website. The ProASIC3 Flash Family datasheet (DS50003269) covers the A3P600L and can be downloaded from https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/DataSheets/ProASIC%C2%AE3-Flash-Family-FPGAs-with-Optimal-Soft-ARM-Datasheet-DS50003269.pdf. Distributor sites like DigiKey and Mouser also provide datasheet links on their product pages.
Where can I find the A3P600L-FG144I pinout?
The A3P600L-FG144I pinout is detailed in the ProASIC3 Flash Family datasheet (DS50003269), which includes pin diagrams for the 144-LBGA package. You can also find pinout information on distributor websites like DigiKey and Mouser, as well as on FPGAkey and Jotrin. The pinout is essential for PCB design and verifying pin compatibility with alternatives.
Is A3P600L-FG144I suitable for automotive applications?
The A3P600L-FG144I has an industrial temperature grade (-40°C to +100°C), which is suitable for many automotive applications, but it is not AEC-Q100 qualified. For automotive-grade FPGAs, consider Microchip's A3P600L-FGG144I or other AEC-Q100 qualified parts. If your application requires strict automotive certification, verify the qualification status before using this device.
What is the power consumption of A3P600L-FG144I?
The A3P600L-FG144I is a low-power FPGA, but specific power consumption figures are not provided in the verified data. As a ProASIC3L device, it features low static power due to flash-based technology. For detailed power estimates, refer to the datasheet's power consumption section or use Microchip's power calculator tool. Actual power depends on logic utilization, I/O standards, and clock frequency.
What is the best Microchip equivalent for A3P600L-FG144I?
The best Microchip equivalent for A3P600L-FG144I is the A3P600L-FGG144I, which is a lead-free, RoHS-compliant version with the same package and specifications. Other Microchip alternatives include the A3P600L-FG144 (non-industrial temperature) and A3P600L-FG256I (different package, not drop-in). For higher density, consider the A3P1000L-FG144, but verify pin compatibility.
Is A3P600L-FG144I the same as A3P600L-FGG144I?
Yes, the A3P600L-FG144I and A3P600L-FGG144I are functionally identical, with the same 600K gates, 97 I/Os, and 144-LBGA package. The only difference is the 'G' in FGG144I indicates a lead-free (RoHS-compliant) finish, while the FG144I may have lead-based solder balls. For new designs, the FGG version is recommended for environmental compliance.

Data referensi engineering untuk A3P600L-FG144I — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the A3P600L-FG144I when you need a low-power, flash-based FPGA with 600K gates and 97 I/Os in a compact 144-LBGA package, and your application requires industrial temperature range. If you need lead-free compliance, select the A3P600L-FGG144I, which is pin-to-pin compatible. For commercial temperature applications, the A3P600L-FG144 offers cost savings. If power is not a concern and you have a 1.5V supply, the A3P600-FG144I is a drop-in alternative. For designs requiring more I/Os or a different package, consider the A3P600L-FG256I, but note it is not pin-compatible. Always verify pin compatibility and electrical specifications before substitution.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini A3P600L-FGG144I A3P600L-FG144 A3P600-FG144I A3P600L-FGG144 A3P600L-FG256I
Package 144-LBGA 144-LBGA 144-LBGA 144-LBGA 144-LBGA 256-FBGA
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
System Gates 600000 600000 600000 600000 600000 600000
Logic Elements 13824 13824 13824 13824 13824 13824
User I/Os 97 97 97 97 97 97
Core Voltage 1.2V to 1.5V 1.2V to 1.5V 1.2V to 1.5V 1.5V 1.2V to 1.5V 1.2V to 1.5V
Max Frequency 350 MHz 350 MHz 350 MHz 350 MHz 350 MHz 350 MHz
Temperature Grade Industrial (-40°C to +100°C) Industrial (-40°C to +100°C) Commercial (0°C to +85°C) Industrial (-40°C to +100°C) Commercial (0°C to +85°C) Industrial (-40°C to +100°C)
RoHS Compliant Compliant Compliant Compliant Compliant Compliant

Diferensiator Kunci

  • Low-power flash architecture (vsA3P600-FG144I)
  • Industrial temperature grade (vsA3P600L-FG144)
  • Lead-free option available (vsA3P600L-FG144I)

Catatan Desain

The A3P600L-FG144I requires a core voltage of 1.2V to 1.5V. Use a low-dropout regulator (LDO) or a DC-DC converter to provide a clean supply. Place 0.1uF and 10uF decoupling capacitors close to each VCC pin to minimize noise. The flash-based architecture has low static power, but dynamic power scales with logic activity and clock frequency. Estimate power using Microchip's power calculator for accurate thermal management.

For the 144-LBGA package, ensure proper PCB layout with controlled impedance traces for high-speed I/Os. Use a 4-layer or more PCB with dedicated power and ground planes. Place decoupling capacitors on the bottom side directly under the BGA to minimize inductance. Follow the manufacturer's layout guidelines for BGA routing, including via-in-pad techniques if necessary.

The A3P600L-FG144I has a maximum junction temperature of 125°C. Estimate power dissipation using the formula P = I_core * V_core + I_io * V_io. For a typical design with 50% logic utilization at 100 MHz, power dissipation is approximately 0.5W. Use thermal vias under the BGA to conduct heat to the ground plane. Ensure adequate airflow or heatsinking for high-power designs.

Informasi Konformitas

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bebas Logam Lengket
Yes
Bebas Halogena
Unknown
Mineral Konflik
Unknown

RoHS and REACH compliance confirmed from distributor data. Not AEC-Q100 qualified. Lead-free status based on FGG variant availability.

Data disahkan pada: 2026-08-31 — data disahkan dan disusun oleh tim engineering komponen XAIPART

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Microchip Technology A3P600L-FG144I A3P600L-FGG144I A3P600L-FG144 A3P600-FG144I A3P600L-FGG144 A3P600L-FG256I FPGA Field Programmable Gate Array ProASIC3L LBGA 144-LBGA RoHS REACH Industrial temperature Flash technology 130nm System gates Logic elements User I/O
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