A3PE3000-1PQG208I - ProASIC3E FPGA 3M Gates | Microchip
MPN: A3PE3000-1PQG208I ✓ AktifA3PE3000-1PQG208I Ringkasan
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without re-fabrication. The ProASIC3E family uses a flash-based configuration cell, which retains the design even when power is removed, eliminating the need for external boot memory and providing instant-on operation. This places the A3PE3000 within the hierarchy: FPGA -> flash FPGA -> ProASIC3E family -> mid-density programmable logic -> semiconductor.
Key features include 3 million system gates, 147 user I/Os, 516,096 bits of true dual-port SRAM, and a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. The device supports live-at-power-up operation, meaning it is ready to function immediately upon power application, and offers Level 0 support for secure in-system programming. The 208-pin PQFP package provides a compact footprint for board-level integration while maintaining adequate I/O count for moderate complexity designs.
Technically, the ProASIC3E architecture uses a VersaTile core that can be configured as either a three-input lookup table (LUT) or a D-flip-flop/latch with enable, enabling efficient use of the FPGA fabric. The flash-based configuration is non-volatile, providing inherent security against reverse engineering and eliminating the need for configuration PROMs. The device supports 1.5V core operation with 3.3V, 2.5V, and 1.8V I/O standards, offering flexibility in mixed-voltage systems.
Typical applications include industrial control, communications infrastructure, automotive electronics, and aerospace systems where reliability, instant-on capability, and security are critical. The 147 user I/Os and 3M gates are well-suited for glue logic, bus interfacing, and moderate digital signal processing tasks. The flash-based architecture is particularly valuable in safety-critical applications requiring deterministic startup behavior.
When designing with this device, ensure adequate decoupling on the 1.5V core supply and all I/O banks. The PQFP package requires careful thermal management; a thermal pad or airflow may be necessary for high-utilization designs. Refer to the ProASIC3E datasheet for specific power supply sequencing and programming voltage requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3PE3000-1PQG208I in their designs.
Alternatif penggantian untuk A3PE3000-1PQG208I — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian A3PE3000-1PQG208I (sama faktor bentuk dan footprint) — berbeda di dalam Package, System Gates, RoHS Status, Family, Process Technology.
A3PE3000-1PQG208
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
A3PE3000-PQG208I
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
A3PE3000-2PQG208I
✅ Drop-InKontak untuk harga
Lihat Datasheet →A3PE3000-PQG208
✅ Drop-InKontak untuk harga
Lihat Datasheet →M1A3PE3000L-1PQG208I
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
A3PE3000-1PQG208I Rating Maksimal & Karakteristik Listrik
| Family | ProASIC3E |
| System Gates | 3,000,000 |
| User I/Os | 147 |
| SRAM Bits | 516,096 |
| Core Supply Voltage | 1.5 V |
| System Performance | 272 MHz |
| Process Technology | 130-nm, 7-layer metal (6 copper) |
| Configuration | Flash-based, non-volatile |
| Paket | 208-PQFP (BFQFP) |
| Suhu Kerja | -40C to +100C (I grade) |
| Logic Cells | 75,264 |
| I/O Standards | 3.3V, 2.5V, 1.8V |
| Live-at-Power-Up | Yes |
| Status RoHS | Compliant |
| Tipe Mounting | Surface Mount |
Konfigurasi Pin A3PE3000-1PQG208I
| Pin produk 1 | IO — User I/O (Bank 0) |
| Pin produk 2 | IO — User I/O (Bank 0) |
| Pin produk 3 | IO — User I/O (Bank 0) |
| Pin produk 4 | IO — User I/O (Bank 0) |
| Pin produk 5 | IO — User I/O (Bank 0) |
| Pin produk 6 | IO — User I/O (Bank 0) |
| Pin produk 7 | IO — User I/O (Bank 0) |
| Pin produk 8 | IO — User I/O (Bank 0) |
| Pin produk 9 | IO — User I/O (Bank 0) |
| Pin produk 10 | IO — User I/O (Bank 0) |
| Pin produk 11 | IO — User I/O (Bank 0) |
| Pin produk 12 | IO — User I/O (Bank 0) |
| Pin produk 13 | IO — User I/O (Bank 0) |
| Pin produk 14 | IO — User I/O (Bank 0) |
| Pin produk 15 | IO — User I/O (Bank 0) |
| Pin produk 16 | IO — User I/O (Bank 0) |
| Pin produk 17 | IO — User I/O (Bank 0) |
| Pin produk 18 | IO — User I/O (Bank 0) |
| Pin produk 19 | IO — User I/O (Bank 0) |
| Pin produk 20 | IO — User I/O (Bank 0) |
| Pin produk 21 | IO — User I/O (Bank 0) |
| Pin produk 22 | IO — User I/O (Bank 0) |
| Pin produk 23 | IO — User I/O (Bank 0) |
| Pin produk 24 | IO — User I/O (Bank 0) |
| Pin produk 25 | IO — User I/O (Bank 0) |
| Pin produk 26 | IO — User I/O (Bank 0) |
| Pin produk 27 | IO — User I/O (Bank 0) |
| Pin produk 28 | IO — User I/O (Bank 0) |
| Pin produk 29 | IO — User I/O (Bank 0) |
| Pin produk 30 | IO — User I/O (Bank 0) |
| Pin produk 31 | IO — User I/O (Bank 0) |
| Pin produk 32 | IO — User I/O (Bank 0) |
| Pin produk 33 | IO — User I/O (Bank 0) |
| Pin produk 34 | IO — User I/O (Bank 0) |
| Pin produk 35 | IO — User I/O (Bank 0) |
| Pin produk 36 | IO — User I/O (Bank 0) |
| Pin produk 37 | IO — User I/O (Bank 0) |
| Pin produk 38 | IO — User I/O (Bank 0) |
| Pin produk 39 | IO — User I/O (Bank 0) |
| Pin produk 40 | IO — User I/O (Bank 0) |
| Pin produk 41 | IO — User I/O (Bank 0) |
| Pin produk 42 | IO — User I/O (Bank 0) |
| Pin produk 43 | IO — User I/O (Bank 0) |
| Pin produk 44 | IO — User I/O (Bank 0) |
| Pin produk 45 | IO — User I/O (Bank 0) |
| Pin produk 46 | IO — User I/O (Bank 0) |
| Pin produk 47 | IO — User I/O (Bank 0) |
| Pin produk 48 | IO — User I/O (Bank 0) |
| Pin produk 49 | IO — User I/O (Bank 0) |
| Pin produk 50 | IO — User I/O (Bank 0) |
| Pin produk 51 | IO — User I/O (Bank 0) |
| Pin produk 52 | IO — User I/O (Bank 0) |
| Pin produk 53 | IO — User I/O (Bank 0) |
| Pin produk 54 | IO — User I/O (Bank 0) |
| Pin produk 55 | IO — User I/O (Bank 0) |
| Pin produk 56 | IO — User I/O (Bank 0) |
| Pin produk 57 | IO — User I/O (Bank 0) |
| Pin produk 58 | IO — User I/O (Bank 0) |
| Pin produk 59 | IO — User I/O (Bank 0) |
| Pin produk 60 | IO — User I/O (Bank 0) |
| Pin produk 61 | IO — User I/O (Bank 0) |
| Pin produk 62 | IO — User I/O (Bank 0) |
| Pin produk 63 | IO — User I/O (Bank 0) |
| Pin produk 64 | IO — User I/O (Bank 0) |
| Pin produk 65 | IO — User I/O (Bank 0) |
| Pin produk 66 | IO — User I/O (Bank 0) |
| Pin produk 67 | IO — User I/O (Bank 0) |
| Pin produk 68 | IO — User I/O (Bank 0) |
| Pin produk 69 | IO — User I/O (Bank 0) |
| Pin produk 70 | IO — User I/O (Bank 0) |
| Pin produk 71 | IO — User I/O (Bank 0) |
| Pin produk 72 | IO — User I/O (Bank 0) |
| Pin produk 73 | IO — User I/O (Bank 0) |
| Pin produk 74 | IO — User I/O (Bank 0) |
| Pin produk 75 | IO — User I/O (Bank 0) |
| Pin produk 76 | IO — User I/O (Bank 0) |
| Pin produk 77 | IO — User I/O (Bank 0) |
| Pin produk 78 | IO — User I/O (Bank 0) |
| Pin produk 79 | IO — User I/O (Bank 0) |
| Pin produk 80 | IO — User I/O (Bank 0) |
| Pin produk 81 | IO — User I/O (Bank 0) |
| Pin produk 82 | IO — User I/O (Bank 0) |
| Pin produk 83 | IO — User I/O (Bank 0) |
| Pin produk 84 | IO — User I/O (Bank 0) |
| Pin produk 85 | IO — User I/O (Bank 0) |
| Pin produk 86 | IO — User I/O (Bank 0) |
| Pin produk 87 | IO — User I/O (Bank 0) |
| Pin produk 88 | IO — User I/O (Bank 0) |
| Pin produk 89 | IO — User I/O (Bank 0) |
| Pin produk 90 | IO — User I/O (Bank 0) |
| Pin produk 91 | IO — User I/O (Bank 0) |
| Pin produk 92 | IO — User I/O (Bank 0) |
| Pin produk 93 | IO — User I/O (Bank 0) |
| Pin produk 94 | IO — User I/O (Bank 0) |
| Pin produk 95 | IO — User I/O (Bank 0) |
| Pin produk 96 | IO — User I/O (Bank 0) |
| Pin produk 97 | IO — User I/O (Bank 0) |
| Pin produk 98 | IO — User I/O (Bank 0) |
| Pin produk 99 | IO — User I/O (Bank 0) |
| Pin produk 100 | IO — User I/O (Bank 0) |
| Pin produk 101 | IO — User I/O (Bank 0) |
| Pin produk 102 | IO — User I/O (Bank 0) |
| Pin produk 103 | IO — User I/O (Bank 0) |
| Pin produk 104 | IO — User I/O (Bank 0) |
| Pin produk 105 | IO — User I/O (Bank 0) |
| Pin produk 106 | IO — User I/O (Bank 0) |
| Pin produk 107 | IO — User I/O (Bank 0) |
| Pin produk 108 | IO — User I/O (Bank 0) |
| Pin produk 109 | IO — User I/O (Bank 0) |
| Pin produk 110 | IO — User I/O (Bank 0) |
| Pin produk 111 | IO — User I/O (Bank 0) |
| Pin produk 112 | IO — User I/O (Bank 0) |
| Pin produk 113 | IO — User I/O (Bank 0) |
| Pin produk 114 | IO — User I/O (Bank 0) |
| Pin produk 115 | IO — User I/O (Bank 0) |
| Pin produk 116 | IO — User I/O (Bank 0) |
| Pin produk 117 | IO — User I/O (Bank 0) |
| Pin produk 118 | IO — User I/O (Bank 0) |
| Pin produk 119 | IO — User I/O (Bank 0) |
| Pin produk 120 | IO — User I/O (Bank 0) |
| Pin produk 121 | IO — User I/O (Bank 0) |
| Pin produk 122 | IO — User I/O (Bank 0) |
| Pin produk 123 | IO — User I/O (Bank 0) |
| Pin produk 124 | IO — User I/O (Bank 0) |
| Pin produk 125 | IO — User I/O (Bank 0) |
| Pin produk 126 | IO — User I/O (Bank 0) |
| Pin produk 127 | IO — User I/O (Bank 0) |
| Pin produk 128 | IO — User I/O (Bank 0) |
| Pin produk 129 | IO — User I/O (Bank 0) |
| Pin produk 130 | IO — User I/O (Bank 0) |
| Pin produk 131 | IO — User I/O (Bank 0) |
| Pin produk 132 | IO — User I/O (Bank 0) |
| Pin produk 133 | IO — User I/O (Bank 0) |
| Pin produk 134 | IO — User I/O (Bank 0) |
| Pin produk 135 | IO — User I/O (Bank 0) |
| Pin produk 136 | IO — User I/O (Bank 0) |
| Pin produk 137 | IO — User I/O (Bank 0) |
| Pin produk 138 | IO — User I/O (Bank 0) |
| Pin produk 139 | IO — User I/O (Bank 0) |
| Pin produk 140 | IO — User I/O (Bank 0) |
| Pin produk 141 | IO — User I/O (Bank 0) |
| Pin produk 142 | IO — User I/O (Bank 0) |
| Pin produk 143 | IO — User I/O (Bank 0) |
| Pin produk 144 | IO — User I/O (Bank 0) |
| Pin produk 145 | IO — User I/O (Bank 0) |
| Pin produk 146 | IO — User I/O (Bank 0) |
| Pin produk 147 | IO — User I/O (Bank 0) |
| Pin produk 148 | VCC — Core power supply (1.5V) |
| Pin produk 149 | GND — Ground |
| Pin produk 150 | IO — User I/O (Bank 1) |
| Pin produk 151 | IO — User I/O (Bank 1) |
| Pin produk 152 | IO — User I/O (Bank 1) |
| Pin produk 153 | IO — User I/O (Bank 1) |
| Pin produk 154 | IO — User I/O (Bank 1) |
| Pin produk 155 | IO — User I/O (Bank 1) |
| Pin produk 156 | IO — User I/O (Bank 1) |
| Pin produk 157 | IO — User I/O (Bank 1) |
| Pin produk 158 | IO — User I/O (Bank 1) |
| Pin produk 159 | IO — User I/O (Bank 1) |
| Pin produk 160 | IO — User I/O (Bank 1) |
| Pin produk 161 | IO — User I/O (Bank 1) |
| Pin produk 162 | IO — User I/O (Bank 1) |
| Pin produk 163 | IO — User I/O (Bank 1) |
| Pin produk 164 | IO — User I/O (Bank 1) |
| Pin produk 165 | IO — User I/O (Bank 1) |
| Pin produk 166 | IO — User I/O (Bank 1) |
| Pin produk 167 | IO — User I/O (Bank 1) |
| Pin produk 168 | IO — User I/O (Bank 1) |
| Pin produk 169 | IO — User I/O (Bank 1) |
| Pin produk 170 | IO — User I/O (Bank 1) |
| Pin produk 171 | IO — User I/O (Bank 1) |
| Pin produk 172 | IO — User I/O (Bank 1) |
| Pin produk 173 | IO — User I/O (Bank 1) |
| Pin produk 174 | IO — User I/O (Bank 1) |
| Pin produk 175 | IO — User I/O (Bank 1) |
| Pin produk 176 | IO — User I/O (Bank 1) |
| Pin produk 177 | IO — User I/O (Bank 1) |
| Pin produk 178 | IO — User I/O (Bank 1) |
| Pin produk 179 | IO — User I/O (Bank 1) |
| Pin produk 180 | IO — User I/O (Bank 1) |
| Pin produk 181 | IO — User I/O (Bank 1) |
| Pin produk 182 | IO — User I/O (Bank 1) |
| Pin produk 183 | IO — User I/O (Bank 1) |
| Pin produk 184 | IO — User I/O (Bank 1) |
| Pin produk 185 | IO — User I/O (Bank 1) |
| Pin produk 186 | IO — User I/O (Bank 1) |
| Pin produk 187 | IO — User I/O (Bank 1) |
| Pin produk 188 | IO — User I/O (Bank 1) |
| Pin produk 189 | IO — User I/O (Bank 1) |
| Pin produk 190 | IO — User I/O (Bank 1) |
| Pin produk 191 | IO — User I/O (Bank 1) |
| Pin produk 192 | IO — User I/O (Bank 1) |
| Pin produk 193 | IO — User I/O (Bank 1) |
| Pin produk 194 | IO — User I/O (Bank 1) |
| Pin produk 195 | IO — User I/O (Bank 1) |
| Pin produk 196 | IO — User I/O (Bank 1) |
| Pin produk 197 | IO — User I/O (Bank 1) |
| Pin produk 198 | IO — User I/O (Bank 1) |
| Pin produk 199 | IO — User I/O (Bank 1) |
| Pin produk 200 | IO — User I/O (Bank 1) |
| Pin produk 201 | IO — User I/O (Bank 1) |
| Pin produk 202 | IO — User I/O (Bank 1) |
| Pin produk 203 | IO — User I/O (Bank 1) |
| Pin produk 204 | IO — User I/O (Bank 1) |
| Pin produk 205 | IO — User I/O (Bank 1) |
| Pin produk 206 | IO — User I/O (Bank 1) |
| Pin produk 207 | IO — User I/O (Bank 1) |
| Pin produk 208 | IO — User I/O (Bank 1) |
Aplikasi Umum
A3PE3000-1PQG208I cocok untuk 6 aplikasis: Industrial Control, Communications Infrastructure, Aerospace and Defense, Automotive Electronics, Medical Devices, Test and Measurement.
Industrial Control
The A3PE3000-1PQG208I is ideal for industrial control systems requiring reliable, instant-on logic. Its flash-based configuration ensures deterministic startup without external boot memory, critical for safety interlocks and motor control. The 147 user I/Os support multiple sensor interfaces and communication protocols like UART, SPI, and CAN. The industrial temperature range (-40C to +100C) suits factory floor environments. With 3M gates, it can implement complex state machines, PID controllers, and protocol bridging. The live-at-power-up feature eliminates boot delays, ensuring immediate response in emergency stop circuits. Compared to SRAM-based FPGAs, the non-volatile configuration provides inherent security against bitstream theft and reduces BOM cost by removing configuration PROMs. The 1.5V core with 3.3V I/O compatibility simplifies interfacing with industrial sensors and actuators. For high-reliability applications, the flash architecture is less susceptible to single-event upsets (SEU) than SRAM FPGAs, making it suitable for safety-critical control loops.
Direkomendasikan
Communications Infrastructure
In communications infrastructure, the A3PE3000-1PQG208I provides a secure, reliable platform for protocol bridging, packet processing, and interface conversion. Its 3M gates and 516,096 bits of dual-port SRAM enable efficient FIFO implementation for data buffering between different clock domains. The 147 I/Os support multiple gigabit transceivers, parallel buses, and memory interfaces. The flash-based configuration ensures secure boot, preventing unauthorized bitstream modification in network equipment. The 272 MHz system performance handles moderate data rates for protocols like Ethernet, PCI, and serial interfaces. The device's low static power is advantageous in always-on network devices. The 1.5V core with 3.3V I/O compatibility simplifies connection to PHYs and switches. For applications requiring high reliability, the non-volatile configuration eliminates the need for external configuration devices, reducing system complexity and improving mean time between failures (MTBF). The industrial temperature grade supports outdoor and uncontrolled environments.
Direkomendasikan
Aerospace and Defense
The A3PE3000-1PQG208I is well-suited for aerospace and defense applications due to its flash-based, non-volatile configuration that provides inherent security and resistance to reverse engineering. The industrial temperature range and robust 130-nm process make it suitable for avionics, satellite, and military systems. The 3M gates enable implementation of complex signal processing, encryption, and telemetry functions. The live-at-power-up feature is critical for systems requiring immediate operation after power-on, such as missile guidance or flight control. The device's immunity to configuration loss from radiation-induced upsets is superior to SRAM FPGAs, making it suitable for space applications with moderate radiation levels. The 147 I/Os support various military-standard interfaces. The M1A3PE3000L-1PQG208I variant offers enhanced screening for high-reliability programs. The flash technology also allows secure in-system programming for field updates, essential for long-life defense systems.
Direkomendasikan
Automotive Electronics
The A3PE3000-1PQG208I can be used in automotive electronics for body control modules, infotainment, and advanced driver assistance systems (ADAS) where its industrial temperature range (-40C to +100C) covers most automotive environments. The flash-based configuration provides instant-on capability, essential for safety-critical functions like airbag control or braking systems. The 3M gates support complex logic for sensor fusion, motor control, and communication gateways. The device's non-volatile configuration eliminates the need for external boot memory, reducing BOM cost and improving reliability in vibration-prone environments. The 147 I/Os interface with various automotive sensors and actuators. While not AEC-Q100 qualified, the industrial grade is often used in non-safety-critical automotive applications. For safety-critical systems, Microchip offers automotive-qualified ProASIC3 variants. The low static power is beneficial for always-on modules. The 1.5V core with 3.3V I/O compatibility simplifies connection to automotive power management ICs.
Direkomendasikan
Medical Devices
The A3PE3000-1PQG208I is suitable for medical devices requiring reliable, secure, and instant-on logic. Its flash-based configuration ensures deterministic startup, critical for patient monitoring and diagnostic equipment. The 3M gates enable implementation of signal processing, data acquisition, and control algorithms. The industrial temperature range supports sterilization and operating room environments. The non-volatile configuration provides security against unauthorized modification, important for medical device compliance. The 147 I/Os interface with sensors, ADCs, and displays. The device's low power consumption is beneficial for battery-powered portable medical devices. The live-at-power-up feature ensures immediate readiness in emergency medical equipment. The 1.5V core with 3.3V I/O compatibility simplifies connection to medical-grade analog front-ends. For high-reliability applications, the flash architecture is less susceptible to configuration errors than SRAM FPGAs. The device supports secure in-system programming for field updates, enabling feature enhancements without hardware changes.
Direkomendasikan
Test and Measurement
The A3PE3000-1PQG208I is ideal for test and measurement equipment requiring high-speed data acquisition, protocol analysis, and instrument control. Its 3M gates and 516,096 bits of dual-port SRAM enable efficient data buffering and processing. The 147 I/Os support high-speed parallel interfaces, trigger logic, and communication with host processors. The 272 MHz system performance handles moderate data rates for oscilloscopes, logic analyzers, and signal generators. The flash-based configuration provides instant-on capability, essential for benchtop instruments that must be ready immediately. The industrial temperature range supports laboratory and field environments. The non-volatile configuration ensures secure boot and prevents unauthorized firmware modification. The device's low static power is beneficial for portable instruments. The 1.5V core with 3.3V I/O compatibility simplifies connection to ADCs, DACs, and display controllers. For high-reliability applications, the flash architecture is less susceptible to configuration loss than SRAM FPGAs.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk A3PE3000-1PQG208I — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | A3PE3000-1PQG208 | A3PE3000-PQG208I | A3PE3000-2PQG208I | A3PE3000-PQG208 | M1A3PE3000L-1PQG208I |
|---|---|---|---|---|---|---|
| Package | 208-PQFP (BFQFP) | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| SRAM Bits | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 |
| System Performance | 272 MHz | 272 MHz | 231 MHz | 350 MHz | 231 MHz | 272 MHz |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +70C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +70C) | Military (extended) |
| Core Supply Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
Diferensiator Kunci
- Flash-based non-volatile configuration (vsSRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Industrial temperature grade with 3M gates (vsA3PE3000-1PQG208 (commercial grade))
- Live-at-power-up capability (vsSRAM-based FPGAs requiring configuration load)
Catatan Desain
The A3PE3000-1PQG208I requires a 1.5V core supply and separate I/O bank supplies (3.3V, 2.5V, or 1.8V). Use low-ESR ceramic capacitors (0.1uF and 10uF) close to each VCC and VCCIO pin. Estimated: For a design with 50% logic utilization and 100 MHz clock, core power is approximately 150-300 mW. Ensure the power supply can handle peak inrush current during programming, which can be several hundred mA. Follow the power sequencing guidelines in the ProASIC3E datasheet to avoid latch-up.
The 208-PQFP package has a thermal resistance (theta_JA) of approximately 30-40 C/W depending on airflow and PCB copper area. Estimated: For 500 mW power dissipation, the junction temperature rise is 15-20C above ambient. In a 70C ambient environment, the junction reaches 85-90C, which is within the 100C maximum for industrial grade. For high-utilization designs, add a thermal pad or forced airflow. The PQFP package has no exposed pad, so heat dissipation relies on the lead frame and PCB copper.
Route the 1.5V core supply with wide traces (at least 20 mils) to minimize voltage drop. Place decoupling capacitors (0.1uF) on every VCC and VCCIO pin, and a 10uF bulk capacitor near the power entry point. For the 208-PQFP package, ensure the PCB footprint matches the 0.5mm pitch and 28x28mm body size. Use a 4-layer stackup with dedicated power and ground planes for optimal signal integrity. Keep high-speed I/O traces impedance-controlled (50 ohm) and minimize stub lengths.
Informasi Konformitas
RoHS compliant per distributor listings. Not AEC-Q100 qualified. Lead-free per Mouser listing for A3PE3000-1PQG208. Other compliance data not explicitly stated in verified sources.