A3PE3000-1PQG208I - ProASIC3E FPGA 3M Gates | Microchip
MPN: A3PE3000-1PQG208I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.3 | $823.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $66.8 | $33,400.00 |
| 1,000 | $59.9 | $59,900.00 |
Drop-in alternatives for A3PE3000-1PQG208I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3PE3000-1PQG208
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000-PQG208I
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000-2PQG208I
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000-PQG208
β Drop-Inπ Reference alternative (not in catalog)
M1A3PE3000L-1PQG208I
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000-1PQG208I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| System Gates | 3,000,000 |
| User I/Os | 147 |
| SRAM Bits | 516,096 |
| Core Supply Voltage | 1.5 V |
| System Performance | 272 MHz |
| Process Technology | 130-nm, 7-layer metal (6 copper) |
| Configuration | Flash-based, non-volatile |
| Package | 208-PQFP (BFQFP) |
| Operating Temperature | -40C to +100C (I grade) |
| Logic Cells | 75,264 |
| I/O Standards | 3.3V, 2.5V, 1.8V |
| Live-at-Power-Up | Yes |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
A3PE3000-1PQG208I Pin Configuration
| Pin 1 | IO β User I/O (Bank 0) |
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| Pin 148 | VCC β Core power supply (1.5V) |
| Pin 149 | GND β Ground |
| Pin 150 | IO β User I/O (Bank 1) |
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Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-1PQG208I is suitable for 6 applications: Industrial Control, Communications Infrastructure, Aerospace and Defense, Automotive Electronics, Medical Devices, Test and Measurement.
Industrial Control
The A3PE3000-1PQG208I is ideal for industrial control systems requiring reliable, instant-on logic. Its flash-based configuration ensures deterministic startup without external boot memory, critical for safety interlocks and motor control. The 147 user I/Os support multiple sensor interfaces and communication protocols like UART, SPI, and CAN. The industrial temperature range (-40C to +100C) suits factory floor environments. With 3M gates, it can implement complex state machines, PID controllers, and protocol bridging. The live-at-power-up feature eliminates boot delays, ensuring immediate response in emergency stop circuits. Compared to SRAM-based FPGAs, the non-volatile configuration provides inherent security against bitstream theft and reduces BOM cost by removing configuration PROMs. The 1.5V core with 3.3V I/O compatibility simplifies interfacing with industrial sensors and actuators. For high-reliability applications, the flash architecture is less susceptible to single-event upsets (SEU) than SRAM FPGAs, making it suitable for safety-critical control loops.
Recommended
Communications Infrastructure
In communications infrastructure, the A3PE3000-1PQG208I provides a secure, reliable platform for protocol bridging, packet processing, and interface conversion. Its 3M gates and 516,096 bits of dual-port SRAM enable efficient FIFO implementation for data buffering between different clock domains. The 147 I/Os support multiple gigabit transceivers, parallel buses, and memory interfaces. The flash-based configuration ensures secure boot, preventing unauthorized bitstream modification in network equipment. The 272 MHz system performance handles moderate data rates for protocols like Ethernet, PCI, and serial interfaces. The device's low static power is advantageous in always-on network devices. The 1.5V core with 3.3V I/O compatibility simplifies connection to PHYs and switches. For applications requiring high reliability, the non-volatile configuration eliminates the need for external configuration devices, reducing system complexity and improving mean time between failures (MTBF). The industrial temperature grade supports outdoor and uncontrolled environments.
Recommended
Aerospace and Defense
The A3PE3000-1PQG208I is well-suited for aerospace and defense applications due to its flash-based, non-volatile configuration that provides inherent security and resistance to reverse engineering. The industrial temperature range and robust 130-nm process make it suitable for avionics, satellite, and military systems. The 3M gates enable implementation of complex signal processing, encryption, and telemetry functions. The live-at-power-up feature is critical for systems requiring immediate operation after power-on, such as missile guidance or flight control. The device's immunity to configuration loss from radiation-induced upsets is superior to SRAM FPGAs, making it suitable for space applications with moderate radiation levels. The 147 I/Os support various military-standard interfaces. The M1A3PE3000L-1PQG208I variant offers enhanced screening for high-reliability programs. The flash technology also allows secure in-system programming for field updates, essential for long-life defense systems.
Recommended
Automotive Electronics
The A3PE3000-1PQG208I can be used in automotive electronics for body control modules, infotainment, and advanced driver assistance systems (ADAS) where its industrial temperature range (-40C to +100C) covers most automotive environments. The flash-based configuration provides instant-on capability, essential for safety-critical functions like airbag control or braking systems. The 3M gates support complex logic for sensor fusion, motor control, and communication gateways. The device's non-volatile configuration eliminates the need for external boot memory, reducing BOM cost and improving reliability in vibration-prone environments. The 147 I/Os interface with various automotive sensors and actuators. While not AEC-Q100 qualified, the industrial grade is often used in non-safety-critical automotive applications. For safety-critical systems, Microchip offers automotive-qualified ProASIC3 variants. The low static power is beneficial for always-on modules. The 1.5V core with 3.3V I/O compatibility simplifies connection to automotive power management ICs.
Recommended
Medical Devices
The A3PE3000-1PQG208I is suitable for medical devices requiring reliable, secure, and instant-on logic. Its flash-based configuration ensures deterministic startup, critical for patient monitoring and diagnostic equipment. The 3M gates enable implementation of signal processing, data acquisition, and control algorithms. The industrial temperature range supports sterilization and operating room environments. The non-volatile configuration provides security against unauthorized modification, important for medical device compliance. The 147 I/Os interface with sensors, ADCs, and displays. The device's low power consumption is beneficial for battery-powered portable medical devices. The live-at-power-up feature ensures immediate readiness in emergency medical equipment. The 1.5V core with 3.3V I/O compatibility simplifies connection to medical-grade analog front-ends. For high-reliability applications, the flash architecture is less susceptible to configuration errors than SRAM FPGAs. The device supports secure in-system programming for field updates, enabling feature enhancements without hardware changes.
Recommended
Test and Measurement
The A3PE3000-1PQG208I is ideal for test and measurement equipment requiring high-speed data acquisition, protocol analysis, and instrument control. Its 3M gates and 516,096 bits of dual-port SRAM enable efficient data buffering and processing. The 147 I/Os support high-speed parallel interfaces, trigger logic, and communication with host processors. The 272 MHz system performance handles moderate data rates for oscilloscopes, logic analyzers, and signal generators. The flash-based configuration provides instant-on capability, essential for benchtop instruments that must be ready immediately. The industrial temperature range supports laboratory and field environments. The non-volatile configuration ensures secure boot and prevents unauthorized firmware modification. The device's low static power is beneficial for portable instruments. The 1.5V core with 3.3V I/O compatibility simplifies connection to ADCs, DACs, and display controllers. For high-reliability applications, the flash architecture is less susceptible to configuration loss than SRAM FPGAs.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-1PQG208I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-1PQG208 | A3PE3000-PQG208I | A3PE3000-2PQG208I | A3PE3000-PQG208 | M1A3PE3000L-1PQG208I |
|---|---|---|---|---|---|---|
| Package | 208-PQFP (BFQFP) | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| SRAM Bits | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 |
| System Performance | 272 MHz | 272 MHz | 231 MHz | 350 MHz | 231 MHz | 272 MHz |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +70C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +70C) | Military (extended) |
| Core Supply Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
Key Differentiators
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Industrial temperature grade with 3M gates (vs A3PE3000-1PQG208 (commercial grade))
- Live-at-power-up capability (vs SRAM-based FPGAs requiring configuration load)
Design Notes
The A3PE3000-1PQG208I requires a 1.5V core supply and separate I/O bank supplies (3.3V, 2.5V, or 1.8V). Use low-ESR ceramic capacitors (0.1uF and 10uF) close to each VCC and VCCIO pin. Estimated: For a design with 50% logic utilization and 100 MHz clock, core power is approximately 150-300 mW. Ensure the power supply can handle peak inrush current during programming, which can be several hundred mA. Follow the power sequencing guidelines in the ProASIC3E datasheet to avoid latch-up.
The 208-PQFP package has a thermal resistance (theta_JA) of approximately 30-40 C/W depending on airflow and PCB copper area. Estimated: For 500 mW power dissipation, the junction temperature rise is 15-20C above ambient. In a 70C ambient environment, the junction reaches 85-90C, which is within the 100C maximum for industrial grade. For high-utilization designs, add a thermal pad or forced airflow. The PQFP package has no exposed pad, so heat dissipation relies on the lead frame and PCB copper.
Route the 1.5V core supply with wide traces (at least 20 mils) to minimize voltage drop. Place decoupling capacitors (0.1uF) on every VCC and VCCIO pin, and a 10uF bulk capacitor near the power entry point. For the 208-PQFP package, ensure the PCB footprint matches the 0.5mm pitch and 28x28mm body size. Use a 4-layer stackup with dedicated power and ground planes for optimal signal integrity. Keep high-speed I/O traces impedance-controlled (50 ohm) and minimize stub lengths.
Compliance Information
RoHS compliant per distributor listings. Not AEC-Q100 qualified. Lead-free per Mouser listing for A3PE3000-1PQG208. Other compliance data not explicitly stated in verified sources.
