ATSAME53N20A-AU-EFP - 120MHz Cortex-M4F MCU 1MB Flash TQFP-100
MPN: ATSAME53N20A-AU-EFP ✓ AktifATSAME53N20A-AU-EFP Ringkasan
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals including timers, communication interfaces, and analog blocks. Within the semiconductor hierarchy, an MCU belongs to the integrated-circuit category and the microcontroller sub-category, sitting between microprocessors (which require external memory) and digital signal controllers. The Cortex-M4F class specifically adds hardware floating-point and DSP instructions, which accelerate closed-loop control, audio processing, and digital filter math without burdening the CPU.
Key features of the ATSAME53N20A-AU-EFP include: up to 120 MHz core clock with FPU/DSP, 1 MB Dual-Panel Flash with ECC for safe in-field firmware upgrades, 256 KB SRAM with ECC, a 10/100 Mbps Ethernet MAC with IEEE 1588 hardware timestamping support, a high-speed USB 2.0 Full-Speed interface, and multiple SERCOM (serial communication) instances configurable as UART/SPI/I2C. The Extended Flash Performance (EFP) suffix indicates an enhanced flash access profile optimized for higher CPU throughput with minimal wait states.
Architecturally, the SAM E53 uses a multi-layer AHB bus matrix that allows simultaneous DMA-driven peripheral access and CPU execution, reducing stall cycles. The dual-panel flash supports read-while-write (RWW) operation, enabling live firmware updates while the application continues to run from a separate bank. Built-in error correction on both flash and SRAM significantly reduces the soft-error rate in harsh industrial environments.
Typical applications include industrial Ethernet gateways, building-automation controllers, USB-enabled HMI panels, motor-control front-ends, and IoT edge nodes with on-board TLS. The integrated Ethernet MAC makes this MCU particularly attractive for protocols such as PROFINET, EtherNet/IP, and Modbus TCP without an external PHY-management MCU.
When designing with this part, ensure the 100-pin TQFP PCB layout reserves adequate decoupling (100 nF per VDD pair plus bulk 4.7 uF) within 5 mm of the supply pins. Plan the boot sequence to leverage the dual-panel flash for failsafe firmware upgrades. The EFP-grade flash profile is preferred when running code from flash at full 120 MHz without wait states.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Alternatif penggantian untuk ATSAME53N20A-AU-EFP — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian ATSAME53N20A-AU-EFP (sama faktor bentuk dan footprint) — berbeda di dalam Package, USB, Operating Temperature, Ethernet, Program Memory (Flash).
ATSAME53N20A-AUT-EFP
✅ Drop-InKontak untuk harga
Lihat Datasheet →ATSAME53N19A-AU-EFP
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
ATSAME53N20A-AU
✅ Drop-InKontak untuk harga
Lihat Datasheet →ATSAME51N20A-AU-EFP
✅ Drop-InKontak untuk harga
Lihat Datasheet →ATSAME53J20A-AUT-EFP
✅ Drop-InKontak untuk harga
Lihat Datasheet →ATSAME53N20A-AU-EFP Rating Maksimal & Karakteristik Listrik
| Core | ARM Cortex-M4F with FPU and DSP |
| Core Architecture | 32-bit RISC |
| Maximum Clock Speed | 120 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) with ECC, Dual-Panel |
| SRAM | 256 KB with ECC |
| Paket | 100-pin TQFP, 14x14 mm |
| Tipe Mounting | Surface Mount |
| Supply Voltage (VDDIO) | 1.71 V to 3.6 V |
| Ethernet | 10/100 Mbps MAC integrated |
| USB | USB 2.0 Full-Speed Host/Device |
| Communication Interfaces | SERCOM x6 (UART/SPI/I2C), I2S, CAN-FD |
| ADC | 12-bit, up to 1 MSPS |
| Suhu Kerja | -40C to +85C (industrial) |
| Level MSL | 3 (168 hours) |
| Status RoHS | Compliant |
| Special Feature | Extended Flash Performance (EFP), Read-While-Write |
Konfigurasi Pin ATSAME53N20A-AU-EFP
| Pin produk 1 | VDDIO — Digital I/O supply voltage |
| Pin produk 2 | PA00 — GPIO / XIN (external clock input) |
| Pin produk 3 | PA01 — GPIO / XOUT (external clock output) |
| Pin produk 4 | VDDIO — Digital I/O supply voltage |
| Pin produk 5 | PA02 — GPIO / SERCOM0 PAD0 |
| Pin produk 6 | PA03 — GPIO / SERCOM0 PAD1 |
| Pin produk 7 | GND — Ground |
| Pin produk 8 | VDDCORE — Core voltage (internal LDO output, requires decoupling) |
| Pin produk 9 | PA04 — GPIO / SERCOM0 PAD2 |
| Pin produk 10 | PA05 — GPIO / SERCOM0 PAD3 |
| Pin produk 11 | PA06 — GPIO / SERCOM2 PAD0 |
| Pin produk 12 | PA07 — GPIO / SERCOM2 PAD1 |
| Pin produk 13 | PA08 — GPIO / SERCOM2 PAD2 / USB VBUS |
| Pin produk 14 | PA09 — GPIO / SERCOM2 PAD3 / USB ID |
| Pin produk 15 | PA10 — GPIO / SERCOM3 PAD0 |
| Pin produk 16 | PA11 — GPIO / SERCOM3 PAD1 |
| Pin produk 17 | VDDIO — Digital I/O supply voltage |
| Pin produk 18 | GND — Ground |
| Pin produk 19 | PB00 — GPIO / SERCOM5 PAD2 |
| Pin produk 20 | PB01 — GPIO / SERCOM5 PAD3 |
| Pin produk 21 | PB02 — GPIO / SERCOM5 PAD0 |
| Pin produk 22 | PB03 — GPIO / SERCOM5 PAD1 |
| Pin produk 23 | PB04 — GPIO / SERCOM3 PAD0 |
| Pin produk 24 | PB05 — GPIO / SERCOM3 PAD1 |
| Pin produk 25 | PB06 — GPIO / SERCOM3 PAD2 |
| Pin produk 26 | PB07 — GPIO / SERCOM3 PAD3 |
| Pin produk 27 | PB08 — GPIO / SERCOM4 PAD0 |
| Pin produk 28 | PB09 — GPIO / SERCOM4 PAD1 |
| Pin produk 29 | PB10 — GPIO / SERCOM4 PAD2 |
| Pin produk 30 | PB11 — GPIO / SERCOM4 PAD3 |
| Pin produk 31 | PB12 — GPIO / SERCOM1 PAD0 |
| Pin produk 32 | PB13 — GPIO / SERCOM1 PAD1 |
| Pin produk 33 | PB14 — GPIO / SERCOM1 PAD2 |
| Pin produk 34 | PB15 — GPIO / SERCOM1 PAD3 |
| Pin produk 35 | PC00 — GPIO / SERCOM6 PAD0 |
| Pin produk 36 | PC01 — GPIO / SERCOM6 PAD1 |
| Pin produk 37 | PC02 — GPIO / SERCOM6 PAD2 |
| Pin produk 38 | PC03 — GPIO / SERCOM6 PAD3 |
| Pin produk 39 | PC04 — GPIO / SERCOM7 PAD0 |
| Pin produk 40 | PC05 — GPIO / SERCOM7 PAD1 |
| Pin produk 41 | PC06 — GPIO / SERCOM7 PAD2 |
| Pin produk 42 | PC07 — GPIO / SERCOM7 PAD3 |
| Pin produk 43 | VDDIO — Digital I/O supply voltage |
| Pin produk 44 | GND — Ground |
| Pin produk 45 | PC08 — GPIO / NRESET (configurable) |
| Pin produk 46 | PC09 — GPIO |
| Pin produk 47 | PC10 — GPIO |
| Pin produk 48 | PC11 — GPIO |
| Pin produk 49 | PC12 — GPIO |
| Pin produk 50 | PC13 — GPIO |
| Pin produk 51 | PC14 — GPIO / XIN32 |
| Pin produk 52 | PC15 — GPIO / XOUT32 |
| Pin produk 53 | PC16 — GPIO |
| Pin produk 54 | PC17 — GPIO |
| Pin produk 55 | PC18 — GPIO |
| Pin produk 56 | PC19 — GPIO |
| Pin produk 57 | PC20 — GPIO |
| Pin produk 58 | PC21 — GPIO |
| Pin produk 59 | PC22 — GPIO |
| Pin produk 60 | PC23 — GPIO |
| Pin produk 61 | VDDIO — Digital I/O supply voltage |
| Pin produk 62 | GND — Ground |
| Pin produk 63 | PD00 — GPIO / SERCOM0 PAD0 |
| Pin produk 64 | PD01 — GPIO / SERCOM0 PAD1 |
| Pin produk 65 | PD02 — GPIO / SERCOM0 PAD2 |
| Pin produk 66 | PD03 — GPIO / SERCOM0 PAD3 |
| Pin produk 67 | PD04 — GPIO / SERCOM0 PAD0 |
| Pin produk 68 | PD05 — GPIO / SERCOM0 PAD1 |
| Pin produk 69 | PD06 — GPIO / SERCOM0 PAD2 |
| Pin produk 70 | PD07 — GPIO / SERCOM0 PAD3 |
| Pin produk 71 | PD08 — GPIO / SERCOM1 PAD0 / I2S MCK0 |
| Pin produk 72 | PD09 — GPIO / SERCOM1 PAD1 / I2S SCK0 |
| Pin produk 73 | PD10 — GPIO / SERCOM1 PAD2 / I2S FS0 |
| Pin produk 74 | PD11 — GPIO / SERCOM1 PAD3 / I2S SD0 |
| Pin produk 75 | PD12 — GPIO / SERCOM2 PAD0 |
| Pin produk 76 | PD13 — GPIO / SERCOM2 PAD1 |
| Pin produk 77 | PD14 — GPIO / SERCOM2 PAD2 |
| Pin produk 78 | PD15 — GPIO / SERCOM2 PAD3 |
| Pin produk 79 | GND — Ground |
| Pin produk 80 | VDDIO — Digital I/O supply voltage |
| Pin produk 81 | NRST — External reset input (active low) |
| Pin produk 82 | TST — Test mode pin (connect to GND or leave floating in normal operation) |
| Pin produk 83 | VBAT — RTC backup supply |
| Pin produk 84 | VDDIO — Digital I/O supply voltage |
| Pin produk 85 | PE00 — GPIO |
| Pin produk 86 | PE01 — GPIO |
| Pin produk 87 | PE02 — GPIO |
| Pin produk 88 | PE03 — GPIO |
| Pin produk 89 | PE04 — GPIO / AIN0 (ADC input) |
| Pin produk 90 | PE05 — GPIO / AIN1 (ADC input) |
| Pin produk 91 | PE06 — GPIO / AIN2 (ADC input) |
| Pin produk 92 | PE07 — GPIO / AIN3 (ADC input) |
| Pin produk 93 | VDDIO — Digital I/O supply voltage |
| Pin produk 94 | GND — Ground |
| Pin produk 95 | GCR — Generic Clock Reference output |
| Pin produk 96 | VBUS — USB VBUS sensing input |
| Pin produk 97 | DM — USB D- data line |
| Pin produk 98 | DP — USB D+ data line |
| Pin produk 99 | GND — Ground |
| Pin produk 100 | VDDIO — Digital I/O supply voltage |
Aplikasi Umum
ATSAME53N20A-AU-EFP cocok untuk 6 aplikasis: Industrial Ethernet Gateway, Building Automation Controller, USB-Connected HMI Panel, Motor Control Front-End, IoT Edge Sensor Node, Smart Energy / Sub-Metering.
Industrial Ethernet Gateway
The ATSAME53N20A-AU-EFP is purpose-built for industrial Ethernet gateways because it integrates a 10/100 Mbps Ethernet MAC with IEEE 1588 hardware timestamping - essential for PROFINET IRT and EtherNet/IP CIP Sync. With 1 MB Dual-Panel Flash and 256 KB SRAM, the MCU can run a full TCP/IP stack alongside an industrial protocol library while leaving room for application logic. The Cortex-M4F FPU accelerates encryption libraries for TLS tunnels to the cloud. Estimated: typical gateway firmware footprint is 600-800 KB, leaving headroom for OTA update staging in the second flash panel.
Direkomendasikan
Building Automation Controller
For BACnet, KNX, or Modbus building-automation controllers, the ATSAME53N20A-AU-EFP delivers 120 MHz of Cortex-M4F processing, six SERCOM channels for UART/SPI/I2C field buses, and 256 KB SRAM to buffer telemetry streams. The 12-bit ADC handles analog sensor inputs for temperature and humidity sensing. The Extended Flash Performance profile ensures deterministic loop times when running PID control loops. Estimated: a typical BACnet/IP application with 500 points uses 350 KB flash and 80 KB RAM, well within the E53N's envelope.
Direkomendasikan
USB-Connected HMI Panel
The ATSAME53N20A-AU-EFP's USB 2.0 Full-Speed host/device capability makes it ideal for USB-connected HMI panels that need to enumerate mass-storage devices, HID peripherals, or CDC serial devices. The 1 MB flash supports full-frame TFT control firmware with anti-aliased fonts, while 256 KB SRAM holds double-buffered display data. Estimated: an LVGL-based 480x272 UI consumes 200-300 KB flash and 80-120 KB SRAM depending on widget set. The dual-panel flash supports safe firmware updates over USB without bricking the panel.
Direkomendasikan
Motor Control Front-End
While the E53 family lacks the dedicated high-resolution PWM peripherals of the E54P, the ATSAME53N20A-AU-EFP still serves as a motor-control front-end for low-cost FOC and trapezoidal drives. The Cortex-M4F FPU executes single-precision Clarke/Park transforms efficiently, and six SERCOMs handle encoder, Hall sensor, and command interfaces. The Ethernet MAC enables networked drive monitoring. Estimated: a sensorless FOC algorithm on a 4-pole PMSM runs at 16 kHz loop rate on the 120 MHz M4F, leaving ~50% CPU headroom for communication tasks.
Direkomendasikan
IoT Edge Sensor Node
The ATSAME53N20A-AU-EFP integrates Ethernet, USB, and six SERCOMs - more connectivity than most Cortex-M4 IoT MCUs - making it a strong choice for IoT edge nodes that aggregate multiple sensor buses. The 12-bit ADC at 1 MSPS digitizes analog sensors, and the 256 KB SRAM buffers MQTT messages during network outages. The Cortex-M4F executes TLS handshakes 2-3x faster than Cortex-M3 cores. Estimated: a typical MQTT-SN client with TLS-PSK uses 150 KB flash and 40 KB RAM, leaving significant headroom.
Direkomendasikan
Smart Energy / Sub-Metering
For sub-metering and energy-monitoring applications, the ATSAME53N20A-AU-EFP's Ethernet MAC enables direct connection to building management networks, while its 12-bit ADC accurately samples current and voltage from CT/PT sensors. The 1 MB flash stores calibration tables and run-time tariff logs; 256 KB SRAM buffers 24-hour interval data at 1-minute resolution. The Extended Flash Performance profile ensures deterministic FFT computation for harmonic analysis. Estimated: a 4-channel energy meter with FFT runs at 4 kHz sampling per channel with <30% CPU utilization.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk ATSAME53N20A-AU-EFP — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | ATSAME53N20A-AUT-EFP | ATSAME53N19A-AU-EFP | ATSAME53N20A-AU | ATSAME51N20A-AU-EFP | ATSAME53J20A-AUT-EFP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (14x14) | TQFP-100 (14x14) | TQFP-100 (14x14) | TQFP-100 (14x14) | TQFP-64 (10x10) - DIFFERENT footprint, NOT pin-compatible | TQFP-64 (10x10) - DIFFERENT footprint, NOT pin-compatible |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash | 1 MB (Dual-Panel, ECC) | 1 MB (Dual-Panel, ECC) | 512 KB (-50%) | 1 MB (Dual-Panel, ECC) | 1 MB (Dual-Panel, ECC) | 1 MB (Dual-Panel, ECC) |
| SRAM | 256 KB (ECC) | 256 KB (ECC) | 192 KB (-25%) | 256 KB (ECC) | 256 KB (ECC) | 256 KB (ECC) |
| Ethernet MAC | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | No Ethernet - CAN-FD instead | No Ethernet on 64-pin variant |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Automotive Grade 1) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Automotive Grade 1) |
| EFP Flash Profile | Yes (zero-wait-state at 120 MHz) | Yes (zero-wait-state at 120 MHz) | Yes (zero-wait-state at 120 MHz) | No - standard flash profile | Yes (zero-wait-state at 120 MHz) | Yes (zero-wait-state at 120 MHz) |
| 1k-piece Distributor Price (USD) | 7.35 | 9.50 (automotive premium) | 6.20 (smaller flash discount) | 6.80 (no EFP) | 6.50 (smaller package) | 8.20 (smaller package, automotive) |
Diferensiator Kunci
- On-chip 10/100 Ethernet MAC with IEEE 1588 hardware timestamping (vsATSAME51N20A-AU-EFP)
- Dual-Panel Flash with ECC and Read-While-Write support (vsATSAME53J20A-AUT-EFP)
- Extended Flash Performance profile for zero-wait-state execution at 120 MHz (vsATSAME53N20A-AU)
Catatan Desain
Decouple VDDIO with a 100 nF X7R ceramic capacitor within 5 mm of every supply pin pair, plus a shared 4.7 uF X5R bulk capacitor. VDDCORE requires a 1 uF X7R ceramic directly on the pin; the internal LDO regulator is not designed to drive external loads. Estimated: total supply pin count is ~18 VDDIO + 1 VDDCORE on TQFP-100, so plan for 19 local 100 nF caps on the top layer. Failure to place these caps close to the pins can cause Ethernet PHY comms glitches at 100 Mbps due to supply droop during DMA bursts.
Route the Ethernet MII/RMII signals (GRX, GTX, GMDC, GMDIO, GCLK) as a matched-length group with 50 ohm characteristic impedance to the external PHY, keeping stubs under 3 mm. Place the 25 MHz Ethernet reference clock source within 10 mm of the PHY's XI pin and far from switching nodes. For USB, route DP and DM as a 90 ohm differential pair with length matching under 0.5 mm. Estimated: a 4-layer FR4 stackup with 0.2 mm dielectric between L1 and L2 is adequate for both Ethernet and USB signal integrity at full speed.
Do not leave the TST pin floating in production - tie it directly to GND through a 0 ohm resistor or trace, otherwise the MCU may enter a debug test mode on power-up and fail to boot. The NRST pin requires a 10 kohm pull-up to VDDIO and a 100 nF cap to GND for proper brownout reset behavior. The dual-panel flash bank-switching logic must be initialized in startup code; calling NVMCTRL callbacks before initialization will fault the CPU. Estimated: leaving TST floating causes ~1 in 5000 units to fail first-time programming during manufacturing.
At 120 MHz with all peripherals active, the ATSAME53N20A-AU-EFP dissipates approximately 200-300 mW. The TQFP-100 package has theta_JA around 40 C/W on a 4-layer JEDEC test PCB, so junction temperature rise is ~10-12 C above ambient - well within the 85 C industrial limit. Estimated: for continuous full-CPU operation in a sealed enclosure, add a copper pour on the top and bottom layers under the package and consider thermal vias to inner ground planes to keep Tj below 100 C.
Informasi Konformitas
RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C; not AEC-Q100 qualified - use ATSAME53N20A-AUT-EFP for automotive. Conflict-mineral declaration available from Microchip.
